DSPIC30F4013-30I/ML Microchip Technology, DSPIC30F4013-30I/ML Datasheet - Page 180

IC DSPIC MCU/DSP 48K 44QFN

DSPIC30F4013-30I/ML

Manufacturer Part Number
DSPIC30F4013-30I/ML
Description
IC DSPIC MCU/DSP 48K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F4013-30I/ML

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
30
Flash Memory Size
48KB
Supply Voltage Range
2.5V To 5.5V
Package
44QFN EP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
30
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
13-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F401330IML
dsPIC30F3014/4013
TABLE 23-11: ELECTRICAL CHARACTERISTICS: BOR
TABLE 23-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
23.2
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
DS70138G-page 180
DC CHARACTERISTICS
BO10
BO15
Note 1:
DC CHARACTERISTICS
D120
D121
D122
D123
D124
D130
D131
D132
D133
D134
D135
D137
D138
Note 1:
Param
Param
No.
No.
2:
3:
2:
AC Characteristics and Timing Parameters
E
V
T
T
I
E
V
V
V
T
T
I
I
Symbol
DEW
PEW
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
‘11’ values not in usable operating range.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DEW
RETD
EB
PEW
RETD
D
DRW
P
PR
PEW
V
V
Symbol
BOR
BHYS
Data EEPROM Memory
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
I
Program Flash Memory
Cell Endurance
V
V
V
Erase/Write Cycle Time
Characteristic Retention
I
I
DD
DD
DD
DD
DD
DD
DD
BOR Voltage on V
Transition
High-to-Low
During Programming
During Programming
During Programming
for Read/Write
for Read
for Bulk Erase
for Erase/Write
Characteristic
Characteristic
(2)
DD
(2)
(2)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
BORV = 11
BORV = 10
BORV = 01
BORV = 00
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
100K
V
V
Min
10K
0.8
4.5
3.0
0.8
40
40
MIN
MIN
(3)
Typ
100K
100
100
1M
10
10
10
2
2
(1)
4.58
Min
2.6
4.1
Max
5.5
2.6
5.5
5.5
5.5
2.6
30
30
30
Typ
-40°C  T
-40°C  T
5
(1)
-40°C  T
-40°C  T
Units
Year
Year
E/W
E/W
mA
mA
mA
ms
ms
V
V
V
V
Max
2.71
4.73
A
A
4.4
 +85°C for Industrial
 +125°C for Extended
-40C  T
Using EECON to read/write
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
-40C  T
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
Bulk Erase
A
A
MIN
MIN
 2010 Microchip Technology Inc.
 +85°C for Industrial
 +125°C for Extended
Units
= Minimum operating
= Minimum operating
mV
V
V
V
V
A
A
Conditions
+85°C
+85°C
Not in operating
range
Conditions

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