C8051T603-GS Silicon Laboratories Inc, C8051T603-GS Datasheet - Page 26

• Manufacturer Part Number: C8051T603-GS
• Description: IC 8051 MCU 4K-EEPROM 14-SOIC
• Manufacturer: Silicon Laboratories Inc
• Series: C8051T60xr

Specifications of C8051T603-GS

• Program Memory Type: OTP
• Program Memory Size: 4KB (4K x 8)
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051T6x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SMBus/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 8
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051T600DK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1404 - KIT DEV FOR C8051T60X MCU'S
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1657-5

C8051T600/1/2/3/4/5/6
6. MSOP-10 Package Specifications
26
Notes:
Dimension
1. All dimensions shown are in millimeters (mm).
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-187, Variation “BA”.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
A1
A2
E1
D
A
E
b
c
Components.
0.00
0.75
0.17
0.08
Min
—
Table 6.1. MSOP-10 Package Dimensions
Figure 6.1. MSOP-10 Package Drawing
3.00 BSC
4.90 BSC
3.00 BSC
Nom
0.85
—
—
—
—
Max
1.10
0.15
0.95
0.33
0.23
Rev. 1.2
Dimension
aaa
bbb
ddd
ccc
L2
e
L

0.40
Min
0°
—
—
—
—
0.50 BSC
0.25 BSC
Nom
0.60
—
—
—
—
—
Max
0.80
0.20
0.25
0.10
0.08
8°