C8051F349-GM Silicon Laboratories Inc, C8051F349-GM Datasheet - Page 33

• Manufacturer Part Number: C8051F349-GM
• Description: IC 8051 MCU 32K FLASH MEM 32-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F34xr

Specifications of C8051F349-GM

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 32-QFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2304 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F340DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1748 - ADAPTER TOOLSTICK FOR C8051F34X
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1349-5

Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.3. TQFP-48 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.3. TQFP-48 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
Rev. 1.3
8.30
8.30
0.20
1.40
Min
0.50 BSC
Max
8.40
8.40
0.30
1.50
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