DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 8

• Manufacturer Part Number: DF2505BR26DV
• Description: IC H8S/2505 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2505BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

9
H8SX /1600
3V series that features a built-in 32-bit multiplier/divider.
Extensive lineup with operating frequencies up to 50 MHz and internal flash memory capacities from 256 KB to 1024 KB.
ROMless products support onboard writing to external flash ROM.*
Built-in functions include a high-precision 16-bit ∆∑A/D converter and a high-speed 10-bit successive approximation A/D converter.
*: The user must provide write and erase programs for the specifications of the flash ROM actually used.
Application Areas
PC peripherals and OA equipment (PC, storage devices, printers, and scanners),
consumer equipment (digital home electronics), and industrial equipment
(FA equipment, POS peripherals, meters, test equipment, and games).
Features of the H8SX/1600 Series
Available in a variety of miniature packages including BP-176V (13 × 13 mm) and TLP-145V (9 × 9 mm).
Laser Printer/Plain Paper Copier Engine System Structure Example
Optical Disc Drive System Structure Example
Flash/ROM capacities from 256/24 KB to 1024/56 KB
Improved peripheral functions, including dual TPU/PPG units, and high-speed SCI/I
Up to three high-speed 10-bit A/D converter units support simultaneous, independent,
and continuous conversion.
Built-in high-precision 16-bit ∆∑ A/D converter
Support for a wide variety of communication formats including USB 2.0 (full speed) and I
Built-in EXDMAC can operate the internal and external busses independently.
New standby mode added. Supports even finer-grained control of the power supply
and provides standby mode operation with low power consumption.
Stepping motor control
• Pulse output:
Pulse output can be easily implemented
by using the TPU and PPG units together.
DC motor control
• PWM pulse output:
Control waveforms can be output
using the TPU PWM output.
• Phase and speed detection:
Control can be implemented using the 16-
bit timer capture function and interrupts.
• Various types of analog control
Ink level detection and various sensor
control operations can be implemen-
ted using the built-in A/D converters.
Driver
Laser
Pick Up
AFE
Actuator
Driver
Spindle
Driver
M
Stepping motor
DC motor
Phase and speed
detection
Motor
driver
Motor
driver
H8SX/1657F
ROM:768KB
H8SX/
DSP
1650
• Address/data multiplexed
• Endian conversion function
output
Single chip solution
Pulse
I/O interface
ROM
ROM:1024KB
H8SX/1638F
Application
program
External BSC: 16 bits
Internal BSC: 32 bits
ROM : 1024KB
H8SX/1638F
RAM : 56KB
SDRAM
H8SX-CPU
16-bit timer
8bit timer
A/D, D/A
DTC
DTC
PPG
CPU performance improvements
• Operating frequency improvements: To 50 MHz and higher
• New instruction set additions for improved code efficiency (83% improvement over earlier CPUs)
• On-chip multiplier/divider unit for improved calculation speeds
• An 8-bit absolute address space that the user can set freely
• Vector table can be freely located by the user
• Single clock cycle memory access achieved by on-chip RAM (24 KB)
Bus controller performance improvements
• Support for a data/address multiplexed I/O interface makes direct interface with a DSP possible.
• Little/big endian conversion function
• All registers and internal busses have been made 32 bits wide.
Large capacity built-in flash memory
• The inclusion of a large capacity (up to 1 MB) flash memory on chip allows large application
programs to be loaded onto the MCU chip itself.
This means that external memory can be reduced.
ASIC
2
Laser driver
C bus units
Interface with the host
Parallel-serial
: Special functions
converters
2
SRAM
Print data
C bus.
I/O
Laser output
H8SX/1648F Block Diagram
Host
H8SX-CPU
High-speed A/D converters:
VBR
Multiplier and divider
three 4-channel units
SCI: 7ch
8bit: 2ch
DMAC
H-UDI
UBC
BSC
DTC
D/A
Large-capacity on-chip flash memory
• Applications:
High-speed operation can be ach-
ieved with internal programs. (Access
to 32 bits in a single clock cycle.)
• Reduced amount of external memory
Reduced costs can be achieved by
reduced parts counts.
oscillator
Clock
SBR
ROM
TPU (16-bit timer):
TPU (16-bit timer):
I
12 channels
8 channels
2
PPG: 2Unit
C-Bus:4ch
I/O port
INTC
WDT
PLL
RAM
H8SX/1638 Group
H8SX/1600 Series Product Development Chart
H8SX/1600 Series Pin Compatibility Diagram
RxD6/IRQ12#-B
SCK6/IRQ13#-B
TxD6
Vcc = 3.3V
768KB/24KB
512KB/24KB
H8SX/1657
H8SX/1650
-KB/24KB
#TRST
1657CF
1656CF
1650C
H8SX/1651 Group
TMS
TCK
TDI
TFP-120
FP-120B
H8SX/1657 Group
#DREQ3
#DACK2
#TEND3
#DACK3
H8SX/1650 Group
512KB/40KB
384KB/40KB
H8SX/1653
H8SX/1651
-KB/40KB
1654F
1653F
1651C
USB2.0, SCI, I
TFP-120
Improved SCI
FP-120B
converter and improved 16-bit timer
High-speed 10-bit A/D
2
P62/TMO2/SCK4/#IRQ10-B
C, IrDA
PB0/#CS0/#CS4/#CS5-B
512KB/40KB
384KB/40KB
H8SX/1663
P56/AN6/DA0/#IRQ6-B
P57/AN7/DA1/#IRQ7-B
PA1/#BACK/(RD/#WR)
P63/TMRI3/#IRQ11-B
PA0/#BREQ0/#BS-A
PA6/#AS/#AH/#BS-B
PA2/#BREQ/#WAIT
PA4/#LHWR/#LUB
1664F
1663F
P50/AN0/#IRQ0-B
P51/AN1/#IRQ1-B
P52/AN2/#IRQ2-B
P53/AN3/#IRQ3-B
P54/AN4/#IRQ4-B
P55/AN5/#IRQ5-B
PA3/#LLWR/#LLB
FP-144L
P64/TMCI3
P65/TMO3
PA5/#RD
PLLVcc
PLLVss
PA7/B
MD0
AVcc
AVss
MD1
Vref
Vss
Vcc
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
∆∑ A/D converter inclusion
converter and on-chip EXDMAC
1024KB/56KB
512KB/40KB
256KB/24KB
H8SX/1638
120pin
TOP VIEW
High-speed 10-bit A/D
1638F
1634F
1632F
FP-120B
ROM-less
1024KB/56KB
BP-176V, FP-144L
512KB/40KB
256KB/24KB
H8SX/1648
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
1648F
1644F
1642F
PH6/D6
PH5/D5
PH4/D4
Vss
PH3/D3
PH2/D2
PH1/D1
PH0/D0
NMI
P37/PO15/TIOCA2/TIOCB2/TCLKD-A
P36/PO14/TIOCA2
P35/PO13/TIOCA1/TIOCB1/TCLKC-A
P34/PO12/TIOCA1
P33/PO11/TIOCC0/TIOCD0/TCLKB-A
P32/PO10/TIOCC0/TCLKA-A
P31/PO9/TIOCA0/TIOCB0
Vcc
P30/PO8/TIOCA0
Vss
P27/PO7/TIOCA5/TIOCB5
P26/PO6/TIOCA5/TMO1/TxD1
P25/PO5/TIOCA4/TMCI1/RxD1
P24/PO4/TIOCA4/TIOCB4/TMRI1/SCK1
P23/PO3/TIOCC3/TIOCD3/#IRQ11-A
P22/PO2/TIOCC3/TMO0/T D0/#IRQ10-A
P21/PO1/TIOCA3/TMCI0/R D0/#IRQ9-A
P20/PO0/TIOCA3/TIOCB3/TMRI0/SCK0/#IRQ8-A
EMLE
PD0/A0
PD1/A1
FLASH
1024KB/56KB
H8SX/1658R
512KB/40KB
384KB/40KB
1658RF
1654RF
1653RF
:New
FP-144L, TLP-145
256KB/24KB
H8SX/1622
FP-120B
1622F
:Under development
Pin function
compatibility
H8SX/1668R
1024KB/56KB
512KB/40KB
384KB/40KB
Improved peripheral functions
High speed: up to 80 MHz
1668RF
1664RF
1663RF
#DACK1-B
#TEND1-B
#DREQ1-B
#DACK0-B
#TEND0-B
#DREQ0-B
ASSP deployment
FP-144L
Next Generation
:In planning stage
IRQ15#
IRQ14#
IRQ13#-A
IRQ12#-A
PJ0/PO16/TIOCA6
PJ1/PO17/TIOCA6/TIOCB6
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