PIC16F716-I/SS Microchip Technology, PIC16F716-I/SS Datasheet - Page 5

• Manufacturer Part Number: PIC16F716-I/SS
• Description: IC PIC MCU FLASH 2KX14 20SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F716-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 13
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC162054 - HEADER INTERFACE ICD2 16F716AC164018 - MODULE SKT PROMATEII 20SSOP
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Instruction Set Summary ............................................................................................................................................................ 71
11.0 Development Support................................................................................................................................................................. 85
12.0 Electrical Characteristics ............................................................................................................................................................ 91
13.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 107
14.0 Packaging Information.............................................................................................................................................................. 109
Appendix A: Revision History............................................................................................................................................................. 113
Appendix B: Conversion Considerations ........................................................................................................................................... 113
Appendix C: Migration from Base-line to MID-RANGE Devices ........................................................................................................ 114
On-Line Support................................................................................................................................................................................. 115
Systems Information and Upgrade Hot Line ...................................................................................................................................... 115
Reader Response .............................................................................................................................................................................. 116
Index .................................................................................................................................................................................................. 117
Product Identification System ............................................................................................................................................................ 123
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Device Overview .......................................................................................................................................................................... 5
Memory Organization ................................................................................................................................................................... 7
I/O Ports ..................................................................................................................................................................................... 19
Timer0 Module ........................................................................................................................................................................... 27
Timer1 Module ........................................................................................................................................................................... 29
Timer2 Module ........................................................................................................................................................................... 31
Enhanced Capture/Compare/PWM (ECCP) Module.................................................................................................................. 33
Analog-to-Digital Converter (A/D) Module.................................................................................................................................. 49
Special Features of the CPU...................................................................................................................................................... 55
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Preliminary
PIC16F716
DS41206A-page 3