DSPIC30F2023-30I/ML Microchip Technology, DSPIC30F2023-30I/ML Datasheet - Page 274

• Manufacturer Part Number: DSPIC30F2023-30I/ML
• Description: IC DSPIC MCU/DSP 12K 44QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2023-30I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 35
• Flash Memory Size: 12KB
• Supply Voltage Range: 3V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• Package: 44QFN EP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/UART
• On-chip Adc: 12-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F1010/202X
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body (QFN)
DS70178C-page 272
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
A1
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
Dimension Limits
2
1
Preliminary
E
EXPOSED
A
NOTE 1
PAD
E2
Units
A1
A3
E2
D2
N
D
e
A
E
b
L
K
2
1
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
NOM
0.90
0.02
6.45
6.45
0.30
0.40
D2
44
—
© 2006 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
—
b
K
e