ATSAM3U4EA-CU Atmel, ATSAM3U4EA-CU Datasheet - Page 2

• Manufacturer Part Number: ATSAM3U4EA-CU
• Description: IC MCU 32BIT 256KB FLSH 144LFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4EA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b, 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 4xUSART, 2xTWI, 5xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, AT91SAM3U-EK, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

1. SAM3U Description
1.1
Table 1-1.
Note:
2
Device
SAM3U4E
SAM3U2E
SAM3U1E
SAM3U4C
SAM3U2C
SAM3U1C
Configuration Summary
1. The SRAM size takes into account the 4-Kbyte RAM buffer of the NAND Flash Controller (NFC) which can be used by the
SAM3U Series
core if not used by the NFC.
Flash
2x128
Kbytes
128
Kbytes
64
Kbytes
2 x 128
Kbytes
128
Kbytes
64
Kbytes
Configuration Summary
Flash
Organization SRAM
dual plane
single plane
single plane
dual plane
single plane
single plane
Atmel's SAM3U series is a member of a family of Flash microcontrollers based on the high per-
formance 32-bit ARM Cortex-M3 RISC processor. It operates at a maximum speed of 96 MHz
and features up to 256 Kbytes of Flash and up to 52 Kbytes of SRAM. The peripheral set
includes a High Speed USB Device port with embedded transceiver, a High Speed MCI for
SDIO/SD/MMC, an External Bus Interface with NAND Flash controller, up to 4xUSARTs
(SAM3U1C/2C/4C have 3), up to 2xTWIs (SAM3U1C/2C/4C have 1), up to 5xSPIs
SAM3U1C/2C/4C have 4), as well as 4xPWM timers, 3xgeneral purpose 16-bit timers, an RTC,
a 12-bit ADC and a 10-bit ADC.
The SAM3U architecture is specifically designed to sustain high speed data transfers. It includes
a multi-layer bus matrix as well as multiple SRAM banks, PDC and DMA channels that enable it
to run tasks in parallel and maximize data throughput.
It can operate from 1.62V to 3.6V and comes in 100-pin and 144-pin LQFP and BGA packages.
The SAM3U device is particularly well suited for USB applications: data loggers, PC peripherals
and any high speed bridge (USB to SDIO, USB to SPI, USB to External Bus Interface).
The SAM3U series differ in memory sizes, package and features list.
configurations of the six devices.
52
Kbytes
36
Kbytes
20
Kbytes
52
Kbytes
36
Kbytes
20
Kbytes
Number
of PIOs
96
96
96
57
57
57
Number
of
USARTs
4
4
4
3
3
3
Number
of TWI
2
2
2
1
1
1
FWUP,
SHDN
pins
Yes
Yes
Yes
FWUP
FWUP
FWUP
External Bus
Interface
8 or 16 bits,
4 chip selects,
24-bit address
8 or 16 bits,
4 chip selects
24-bit address
8 or 16 bits,
4 chip selects,
24-bit address
8 bits,
2 chip selects,
8-bit address
8 bits,
2 chip selects, 8-
bit address
8 bits
2 chip selects,
8-bit address
HSMCI
data
size
8 bits
8 bits
8 bits
4 bits
4 bits
4 bits
Table 1-1
Package
LQFP144
BGA144
LQFP144
BGA144
LQFP144
BGA144
LQFP100
BGA100
LQFP100
BGA100
LQFP100
BGA100
6430DS–ATARM–28-Mar-11
summarizes the
ADC
2 (8+ 8
channels)
2 (8+ 8
channels)
2 (8+ 8
channels)
2 (4+ 4
channels)
2 (4+ 4
channels)
2 (4+ 4
channels)