ATSAM3U4EA-CU Atmel, ATSAM3U4EA-CU Datasheet - Page 9

• Manufacturer Part Number: ATSAM3U4EA-CU
• Description: IC MCU 32BIT 256KB FLSH 144LFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4EA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b, 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 4xUSART, 2xTWI, 5xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, AT91SAM3U-EK, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4. Package and Pinout
4.1
4.1.1
4.1.2
6430DS–ATARM–28-Mar-11
SAM3U4/2/1E Package and Pinout
144-ball LFBGA Package Outline
144-lead LQFP Package Outline
The SAM3U4/2/1E is available in 144-lead LQFP and 144-ball LFBGA packages.
The SAM3U4/2/1C is available in 100-lead LQFP and 100-ball LFBGA packages.
The 144-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimen-
sions are 10 x 10 x 1.4 mm.
Figure 4-1.
Figure 4-2.
Orientation of the 144-ball LFBGA Package
Orientation of the 144-lead LQFP Package
BALL A1
144
109
12
11
10
9
8
7
6
5
4
3
2
1
108
1
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SAM3U Series
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