ATSAM3U4EA-CU Atmel, ATSAM3U4EA-CU Datasheet - Page 54

• Manufacturer Part Number: ATSAM3U4EA-CU
• Description: IC MCU 32BIT 256KB FLSH 144LFBGA
• Manufacturer: Atmel
• Series: SAM3Ur

Specifications of ATSAM3U4EA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 52K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b, 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 52 KB
• Interface Type: 4xUSART, 2xTWI, 5xSPI, Bus
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 8
• Operating Supply Voltage: 1.62 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-CM3, AT91SAM3U-EK, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3U-EK
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Figure 13-3. 144-lead LQFP Package Drawing
Notes:
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1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
SAM3U Series
plastic body size dimensions including mold mismatch.
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
6430DS–ATARM–28-Mar-11