LT1055CN8 Linear Technology, LT1055CN8 Datasheet - Page 15

IC PREC OP-AMP JFET HI-SPD 8-DIP

LT1055CN8

Manufacturer Part Number
LT1055CN8
Description
IC PREC OP-AMP JFET HI-SPD 8-DIP
Manufacturer
Linear Technology
Datasheet

Specifications of LT1055CN8

Amplifier Type
J-FET
Number Of Circuits
1
Slew Rate
12 V/µs
Gain Bandwidth Product
4.5MHz
Current - Input Bias
30pA
Voltage - Input Offset
120µV
Current - Supply
2.8mA
Voltage - Supply, Single/dual (±)
±5 V ~ 18 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Output Type
-
Current - Output / Channel
-
-3db Bandwidth
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT1055CN8
Manufacturer:
LT
Quantity:
1 831
Part Number:
LT1055CN8
Manufacturer:
SIEMENS
Quantity:
1 835
Part Number:
LT1055CN8#PBF
Manufacturer:
LT
Quantity:
584
PACKAGE DESCRIPTIO
SEATING
PLANE
45°TYP
NOTE:
1. DIMENSIONS ARE
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
(0.254 – 1.143)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.010 – 0.045*
(0.711 – 0.864)
0.028 – 0.034
(7.620 – 8.255)
(0.203 – 0.381)
(
8.255
.300 – .325
.008 – .015
.325
(2.794 – 4.064)
0.110 – 0.160
INSULATING
+0.889
–0.381
+.035
–.015
STANDOFF
U
(1.016)
0.040
MAX
)
MILLIMETERS
INCHES
8-Lead TO-5 Metal Can (.200 Inch PCD)
(8.509 – 9.398)
(7.747 – 8.509)
0.335 – 0.370
0.305 – 0.335
(Reference LTC DWG # 05-08-1320)
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
OBSOLETE PACKAGE
(0.406 – 0.533)
DIA
0.016 – 0.021**
PIN 1
(1.651)
(0.686 – 1.143)
(6.477 ± 0.381)
N8 Package
.065
0.027 – 0.045
TYP
H Package
.255 ± .015*
**
*
(1.270)
0.050
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
MAX
GAUGE
PLANE
(5.080)
0.200
(2.54)
TYP
.100
BSC
(1.143 – 1.651)
.045 – .065
(12.700 – 19.050)
8
1
(4.191 – 4.699)
0.165 – 0.185
0.500 – 0.750
2
(10.160)
7
MAX
.400*
6
3
REFERENCE
PLANE
5
4
(0.457 ± 0.076)
.018 ± .003
(3.302 ± 0.127)
.130 ± .005
(3.048)
.120
MIN
(0.406 – 0.610)
0.016 – 0.024
H8(TO-5) 0.200 PCD 1197
(0.508)
.020
MIN
N8 1002
LT1055/LT1056
15
10556fc

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