MC33204DG ON Semiconductor, MC33204DG Datasheet - Page 18

• Manufacturer Part Number: MC33204DG
• Description: IC OPAMP QUAD R-R LV 14-SOIC
• Manufacturer: ON Semiconductor

Specifications of MC33204DG

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 1 V/µs
• Gain Bandwidth Product: 2.2MHz
• Current - Input Bias: 80nA
• Voltage - Input Offset: 10000µV
• Current - Supply: 1.125mA
• Current - Output / Channel: 80mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 12 V, ±0.9 V ~ 6 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Number Of Channels: 4
• Common Mode Rejection Ratio (min): 60 dB
• Input Voltage Range (max): Positive Rail
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 10 mV
• Input Bias Current (max): 200 nA
• Operating Supply Voltage: 12 V
• Supply Current: 3.6 mA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Dual Supply Voltage: +/- 3 V, +/- 5 V
• Maximum Dual Supply Voltage: +/- 6 V
• Minimum Dual Supply Voltage: +/- 0.9 V
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 12 V
• Supply Voltage (min): 1.8 V
• Technology: Bipolar
• Voltage Gain Db: 109.54 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC33204DG; MC33204DGOS

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SEATING
PLANE
−T−
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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14
1
G
−A−
D
14 PL
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
S
0.25 (0.010)
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE J
M
7.04
7X
B
18
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MC33201/D
MAX
7
_