TCM810RENB713 Microchip Technology, TCM810RENB713 Datasheet - Page 9

IC RESET MONITOR 2.63V SOT23B

TCM810RENB713

Manufacturer Part Number
TCM810RENB713
Description
IC RESET MONITOR 2.63V SOT23B
Manufacturer
Microchip Technology
Type
Simple Reset/Power-On Resetr
Datasheets

Specifications of TCM810RENB713

Number Of Voltages Monitored
1
Output
Push-Pull, Totem Pole
Reset
Active High
Reset Timeout
140 ms Minimum
Voltage - Threshold
2.63V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Threshold Voltage
2.63V
No. Of Supervisors / Monitors
1
Supply Voltage Range
1.2V To 5.5V
Reset Type
Active-High
Supply Current
9µA
Delay Time
320ms
Digital Ic Case Style
SOT-23
Monitored Voltage
2.5 V, 3 V, 3.3 V, 5 V
Output Type
Active High, Push-Pull
Manual Reset
Not Resettable
Watchdog
No Watchdog
Battery Backup Switching
No Backup
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1 V
Supply Current (typ)
9 uA
Maximum Power Dissipation
320 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Power Fail Detection
No
Undervoltage Threshold
2.59 V
Overvoltage Threshold
2.66 V
Power-up Reset Delay (typ)
560 ms
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
158-2028-2
158-2028-2
TCM810RENB713TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TCM810RENB713
Manufacturer:
Microchip Technology
Quantity:
15 450
Part Number:
TCM810RENB713
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
TCM810RENB713
Quantity:
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3-Lead Plastic Small Outline Transistor (LB) (SC-70)
© 2005 Microchip Technology Inc.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
*Controlling Parameter
Notes:
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
B
b
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
3
E1
E
Dimension Limits
2
1
L
Units
p1
A2
E1
A1
p
E
D
L
B
a
A
c
b
a
p
p1
MIN
A
.026 BSC.
.051 BSC.
.004
.000
.045
.003
.006
.031
.031
.071
.071
INCHES
D
3
MAX
.0004
.043
.039
.094
.053
.089
.016
.010
.016
TCM809/TCM810
12°
12°
MIN
MILLIMETERS*
0.65 BSC.
1.30 BSC.
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.08
0.15
3
MAX
1.10
1.00
.010
2.40
1.35
2.25
0.25
0.40
0.41
12°
12°
DS21661D-page 9
A2
A1

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