IC REG LDO 3.3V 250MA TO-92-3

MCP1702-3302E/TO

Manufacturer Part NumberMCP1702-3302E/TO
DescriptionIC REG LDO 3.3V 250MA TO-92-3
ManufacturerMicrochip Technology
MCP1702-3302E/TO datasheets
 


Specifications of MCP1702-3302E/TO

Package / CaseTO-92-3 (Standard Body), TO-226Regulator TopologyPositive Fixed
Voltage - Output3.3VVoltage - InputUp to 13.2V
Voltage - Dropout (typical)0.525V @ 250mANumber Of Regulators1
Current - Output250mA (Min)Operating Temperature-40°C ~ 125°C
Mounting TypeThrough HoleNumber Of Outputs1
PolarityPositiveInput Voltage Max13.2 V
Output Voltage3.3 VOutput TypeFixed
Dropout Voltage (max)0.725 V at 250 mAOutput Current250 mA
Line Regulation0.1 % / VLoad Regulation1 %
Voltage Regulation Accuracy0.4 %Maximum Operating Temperature+ 125 C
Mounting StyleThrough HoleMinimum Operating Temperature- 40 C
Primary Input Voltage4.03VOutput Voltage Fixed3.3V
Dropout Voltage Vdo625mVNo. Of Pins3
Voltage Regulator Case StyleTO-92Operating Temperature Range-40°C To +125°C
Rohs CompliantYesLead Free Status / RoHS StatusLead free / RoHS Compliant
For Use WithGPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPADCurrent - Limit (min)-
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MCP1702
6.0
APPLICATION CIRCUITS AND
ISSUES
6.1
Typical Application
The MCP1702 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage makes it ideal for many battery-powered
applications.
MCP1702
V
GND
(2.8V to 3.2V)
V
OUT
V
IN
1.8V
V
OUT
I
OUT
C
OUT
150 mA
1 µF Ceramic
FIGURE 6-1:
Typical Application Circuit.
6.1.1
APPLICATION INPUT CONDITIONS
Package Type = SOT-23A
Input Voltage Range = 2.8V to 3.2V
V
maximum = 3.2V
IN
V
typical = 1.8V
OUT
I
= 150 mA maximum
OUT
6.2
Power Calculations
6.2.1
POWER DISSIPATION
The internal power dissipation of the MCP1702 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x V
). The following equation can be used to
IN
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
 I
P
=
V
V
IN MAX 
LDO
OUT MIN
Where:
P
= LDO Pass device internal
LDO
power dissipation
V
= Maximum input voltage
IN(MAX)
V
= LDO minimum output voltage
OUT(MIN)
The
maximum
continuous
operating
temperature specified for the MCP1702 is +125
estimate the internal junction temperature of the
MCP1702, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (R
). The thermal resistance from junction to
JA
ambient for the SOT-23A pin package is estimated at
336
C/W.
°
DS22008E-page 14
EQUATION 6-2:
T
J MAX
Where:
T
J(MAX)
P
TOTAL
R
JA
T
AMAX
The maximum power dissipation capability for a
IN
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
C
IN
temperature for the application. The following equation
1 µF Ceramic
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
P
D MAX
Where:
P
D(MAX)
T
J(MAX)
T
A(MAX)
R
JA
EQUATION 6-4:
Where:
T
J(RISE)
OUT MAX 
P
TOTAL
R
JA
EQUATION 6-5:
junction
Where:
C
To
°
.
T
J
T
J(RISE)
T
A
=
+
P
R
T
TOTAL
JA
AMAX
= Maximum continuous junction
temperature
= Total device power dissipation
Thermal resistance from
junction to ambient
= Maximum ambient temperature
T
T
J MAX
A MAX
=
---------------------------------------------------
R
JA
= Maximum device power
dissipation
= Maximum continuous junction
temperature
Maximum ambient temperature
= Thermal resistance from
junction to ambient
T
=
P
R
J RISE
D MAX
JA
= Rise in device junction
temperature over the ambient
temperature
= Maximum device power
dissipation
Thermal resistance from
junction to ambient
T
=
T
+
T
J
J RISE
A
= Junction Temperature
= Rise in device junction
temperature over the ambient
temperature
Ambient temperature
 2010 Microchip Technology Inc.