MCP1727-1802E/SN Microchip Technology, MCP1727-1802E/SN Datasheet - Page 25

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MCP1727-1802E/SN

Manufacturer Part Number
MCP1727-1802E/SN
Description
IC REG LDO 1.5A 1.8V 8SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP1727-1802E/SN

Regulator Topology
Positive Fixed
Voltage - Output
1.8V
Voltage - Input
2.3 ~ 6 V
Voltage - Dropout (typical)
0.33V @ 1.5A
Number Of Regulators
1
Current - Output
1.5A (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Primary Input Voltage
2.3V
Output Voltage Fixed
1.8V
Dropout Voltage Vdo
330mV
No. Of Pins
8
Output Current
1.5A
Operating Temperature Range
-40°C To +125°C
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
6 V
Output Voltage
1.8 V
Output Type
Fixed
Dropout Voltage (max)
0.55 V at 1.5 A
Line Regulation
0.05 % / V
Load Regulation
0.5 %
Voltage Regulation Accuracy
2 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1727-1802E/SN
Manufacturer:
Microchip Technology
Quantity:
135
© 2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
φ
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
0.10
0.40
0.31
MIN
1.25
0.25
0.17
L1
h
L
MILLMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
α
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
MCP1727
c
DS21999B-page 25

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