TISP8211MDR-S Bourns Inc., TISP8211MDR-S Datasheet

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TISP8211MDR-S

Manufacturer Part Number
TISP8211MDR-S
Description
SURGE PROT THYRIST POS V SLIC
Manufacturer
Bourns Inc.
Datasheets
1.TISP8210MDR-S.pdf (2 pages)
2.TISP8210MDR-S.pdf (6 pages)
3.TISP8201MDR-S.pdf (11 pages)

Specifications of TISP8211MDR-S

Technology
Mixed Technology
Number Of Circuits
1
Applications
SLIC
Package / Case
8-SOIC (3.9mm Width)
Breakover Current Ibo Max
11 A
Rated Repetitive Off-state Voltage Vdrm
120 V
Off-state Leakage Current @ Vdrm Idrm
0.005 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Working
-
Voltage - Clamping
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
TISP8211MDR-STR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
TISP8211MDR-S
Manufacturer:
BOURNS/伯恩斯
Quantity:
20 000
T H Y R I S T O R S U R G E P R O T E C T O R S
May, 2008
Bourns Manufacturers Representatives
Corporate Distributor Product Managers
Americas Sales Team
Asia Sales Team
Europe Sales Team
Thyristor Surge Protector Product Change Notification
PCN Tracking Number 46 —
Change from Gold to Copper Wire
Bourns has qualified a change to the base metal composition of the wires used to bond overvoltage
protection chips to the package terminals. These interconnect wires are fully encapsulated during
manufacture and are internal to the device package outline.
This qualification covers products assembled in 8-pin SOP (150mil) packages (MS012, JEDEC 95) at
Cirtek Electronics Corporation, 116 East Main Avenue, Phase V, SEZ Laguna Technopark, Binan,
Laguna, Philippines.
Products Affected by the Change:
All overvoltage protection products assembled using the 8-pin SOP (150mil) package, MS-012,
JEDEC 95. A list of products is provided on page 4 of this document.
Reason for the Change:
Copper wire is now a technically viable alternative to gold wire after several years’ development of the
wirebond process by mainstream bonder suppliers. There are advantages arising from improved
electrical conductivity of the wire and removing the effects of gold price volatility on product pricing.
Product Labeling:
Product marking is unchanged.
Identification of the Changed Product:
Bourns maintains traceability back to source wafer lots and assembly sites for all products.
Implementation Date:
Assembly of product will begin August 2008. Deliveries to customers may occur from September 2008
onwards.
TSP0806

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TISP8211MDR-S Summary of contents

Page 1

May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe ...

Page 2

May, 2008 Page First Date Code with Copper Wire: 0834 Impact on Form, Fit, Function and Reliability: The package outline dimensions will continue to meet MS012, JEDEC 95 and the current Bourns datasheet. Datasheet product ratings and ...

Page 3

May, 2008 Page Qualification Results: Stress Test Conditions HTRB 150 °C,1000 h THB 85 °C/85 %RH, 1000 h T Cycle 65/+150 °C, 200 cs Wire Pull Strength >40 g Wire Shear Strength >40 g Samples subjected to ...

Page 4

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