LMV1099TL/NOPB National Semiconductor, LMV1099TL/NOPB Datasheet

IC AMP NOISE SUPPRESSION 25-MSMD

LMV1099TL/NOPB

Manufacturer Part Number
LMV1099TL/NOPB
Description
IC AMP NOISE SUPPRESSION 25-MSMD
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
Class ABr
Datasheet

Specifications of LMV1099TL/NOPB

Output Type
Headphones, 1-Channel (Mono)
Max Output Power X Channels @ Load
83mW x 1 @ 32 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Differential Inputs, I²C, Microphone, Mute, Shutdown
Mounting Type
Surface Mount
Package / Case
25-UFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LMV1099TL/NOPBTR
© 2011 National Semiconductor Corporation
Uplink Far Field Noise Suppression & Downlink SNR
Enhancing Microphone Amplifier with Earpiece Driver
General Description
The LMV1099 is an uplink and downlink voice intelligibility
enhancing analog IC, ideally suited for mobile handsets. Up-
link voice intelligibility is improved by rejecting far-field noise
through a unique two-microphone solution. Downlink voice
intelligibility is improved by enhancing the SNR (Signal-to-
Noise Ratio) between the downlink voice and the ambient
noise environment at the user’s earpiece.
The LMV1099 preserves uplink near-field voice signals within
close range of the microphones while rejecting far-field
acoustic noise greater than 0.5m from the microphones.
The LMV1099 also enhances downlink voice intelligibility by
improving near-field SNR based on the user’s environment.
The analog circuitry adapts dynamically to both the user’s
ambient noise environment as well as the downlink signal
amplitude to ensure optimum SNRI (signal-to-noise ratio im-
provement). The downlink path also provides uplink noise
attenuation through an adjustable high pass filter before the
SNR enhanced downlink voice reaches the user’s earpiece.
Unlike digital-based noise reduction solutions, the all-analog
low power consuming LMV1099 increases both uplink and
downlink voice intelligibility without DSP-type artifacts, distor-
tions or processing delays.
Key Specifications
■ 
■ 
■ 
■ 
Uplink Far Field Noise Suppression
Near-Field SNR Enhancement
Downlink SNRI
Supply voltage range
(Electrical FFNS
E
E
at f = 1kHz)
301076
FIGURE 1. Voice Enhanced Signal
6 to 18dB (typ)
2.7V to 5.5V
33dB (typ)
16dB (typ)
LMV1099
Features
Applications
■ 
■ 
■ 
■ 
■ 
■ 
Noise reduction without DSP-type artifacts.
Adapting AGC (Automatic Gain Control) on ambient noise
level & downlink signal strength
Downlink adjustable noise-reducing high pass filter
Separate Uplink & Downlink Enable Functions
No added process delays
Low power consumption
Shutdown function
Maximum AGC Limiter
Differential inputs & outputs for noise immunity
Earpiece amplifier
Available in a 25-bump micro SMD
Mobile Handsets
Mobile and handheld two-way radios
Bluetooth and other power headsets
Supply current (V
Shutdown current
Uplink PSRR (f = 217Hz)
Downlink SNR (A-weighted)
Downlink THD+N
Earpiece output power
(R
L
= 32Ω)
DD
= 3.6V)
30107630
March 31, 2011
www.national.com
0.06μA (typ)
3.8mA (typ)
106dB (typ)
102dB (typ)
83mW (typ)
0.03% (typ)

Related parts for LMV1099TL/NOPB

LMV1099TL/NOPB Summary of contents

Page 1

... FFNS 1kHz) E ■  Near-Field SNR Enhancement ■  Downlink SNRI E ■  Supply voltage range © 2011 National Semiconductor Corporation LMV1099 ■  Supply current (V ■  Shutdown current ■  Uplink PSRR (f = 217Hz) ■  Downlink SNR (A-weighted) ■ ...

Page 2

Block Diagram www.national.com 2 30107604 ...

Page 3

Typical Application FIGURE 2. Typical Application Circuit Diagram 3 30107605 www.national.com ...

Page 4

Connection Diagrams 25 – Bump micro SMD Marking Top View X = Plant Code Y = Date Code TT = Die Traceability ZA5 = LMV1099TL Order Number Package LMV1099TL 25 Bump microSMD LMV1099TLX 25 Bump microSMD www.national.com 25 – Bump ...

Page 5

Pin Descriptions PIN NAME D5 MIC1+ E5 MIC1- B5 MIC2+ C5 MIC2- E4 MIC BIAS E3 REF D3 OUT+ C3 LPF+ D4 OUT- C4 LPF- PIN NAME A4 DV+ A5 DV- A2 CT1 B2 CT2 B1 CT3 A3 GND D1 ...

Page 6

... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature ESD Rating (HBM) (Note 4) ESD Rating (MM) (Note 5) ESD Rating (CDM) (Note 6) Junction Temperature (T ) JMAX Mounting Temperature   ...

Page 7

Symbol Parameter PSRR Power Supply Rejection Ratio CMRR Common Mode Rejection Ratio V Microphone Bias Supply Voltage BM e Microphone Bias Supply Noise VBM Maximum Microphone Reference Output I BMAX Current V Maximum Input Signal (Differential) IN(DV) V Output Offset ...

Page 8

Interface Characteristics V The following specifications apply for LS and HP VOLUMEGAIN = 0dB LSGAIN = 12B, HPGAIN = 0dB, EPGAIN = 0dB, R +30μH (Loudspeaker 32Ω (Headphone specified. Limits apply for T ...

Page 9

Test Methods FAR FIELD NOISE SUPPRESSION (FFNS For optimum noise suppression the far field noise should broadside array configuration from the two microphones, see Figure 10. Which means the far field sound source is equidistance from the ...

Page 10

Typical Performance Characteristics Input Voltage = 18mV , f =1 kHz, pass through mode (Note 8), Pre Amp gain = 20dB, Post Amp gain = 6dB, R P-P = 32Ω 1kHz, SNR Enhancer disabled 4.7pf. Downlink ...

Page 11

THD+N vs Output Power V = 3.6V, Downlink Path DD 30107666 THD+N vs Input Voltage Mic1 Noise Cancelling Mode Mic2 = AC GND, Uplink Path 30107668 Output Power vs Power Dissipation V = 3.6V, Downlink Path DD 30107627 THD+N vs ...

Page 12

PSRR vs Frequency V = 3.6V RIPPLE Input Referred, Input = AC Ground Downlink Path PSRR vs Frequency Input Referred, V RIPPLE Input = AC Ground, Downlink Path www.national.com = 200mV P-P 30107632 = ...

Page 13

Application Data UPLINK FAR-FIELD NOISE REDUCTION OVERVIEW The uplink portion of the LMV1099 is a fully analog solution to reduce the far field noise picked up by microphones in a FIGURE 4. Simplified Block Diagram of the LMV1099 Uplink path ...

Page 14

Example 1: An application using microphones with 50mV output voltage, and a baseband chip after the LMV1099 with 1.5V maximum input voltage. P-P For optimum noise performance, the gain of the input stage should be set to the maximum. 1. ...

Page 15

RESET PIN When the RESET pin is pulled low, the device will go into shutdown and the Power_on bit (see Table 3) in the shutdown control register will reset. The device will remain in ...

Page 16

B7 Chip Address 1 NOTE: The 7th Bit (B7) of the Register Data determines whether it will activate Register A or Register B. Register Register Name Address B<6:5> Shutdown 00 control Mic mode 01 control Mic Gain control 10 EP ...

Page 17

TABLE 6. LMV1099 Microphone Gain Control Register BIT NAME B4 mic_post_gain mic_pre_gain<3> 0 mic_pre_gain<2> B3:B0 0 mic_pre_gain<1> 1 mic_pre_gain<0> TABLE 7. LMV1099 Earpiece Control Register BIT ...

Page 18

Shutdown Function As part of the Powerwise™ family, the LMV1099 consumes only 0.50mA of current. In many applications the part does not need to be continuously operational. To further reduce the power consumption in the inactive period, the LMV1099 pro- ...

Page 19

Microphone Placement Because the LMV1099 is a microphone array Far Field Noise Reduction solution, proper microphone placement is critical for optimum performance. Two things need to be considered: The spacing between the two microphones and the position of the two ...

Page 20

Low-Pass Filter At The Output At the output of the LMV1099 there is a provision to create order low-pass filter (only enabled in 'Noise Cancelling' mode). This low-pass filter can be used to compensate for the change ...

Page 21

Measuring Uplink Noise and SNR The overall noise of the LMV1099 is measured within the fre- quency band from 10Hz to 22kHz using an A-weighted filter. For the signal to noise ratio (SNR) the signal level at the out- put ...

Page 22

Revision History Rev Date 1.0 08/12/10 1.01 12/10/10 1.02 03/30/11 www.national.com Description Initial release. Added the X1, X2, and X3 values of the mktg outline. Edited Table 3 (Control Registers). 22 ...

Page 23

Physical Dimensions inches (millimeters) unless otherwise noted X1 = 2.644±0.030mm, 25 Bump micro SMD Technology NS Package Number TLA25GMA X2 = 2.771±0.030mm 0.600±0.075mm, 23 www.national.com ...

Page 24

... For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Amplifiers www.national.com/amplifiers Audio www.national.com/audio Clock and Timing www.national.com/timing Data Converters www.national.com/adc Interface www.national.com/interface LVDS www.national.com/lvds Power Management www.national.com/power Switching Regulators www.national.com/switchers LDOs www.national.com/ldo LED Lighting www ...

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