FT245RQ-REEL FTDI, FT245RQ-REEL Datasheet - Page 30

• Manufacturer Part Number: FT245RQ-REEL
• Description: USB Interface IC USB to Parallel FIFO Enhanced IC QFN-32
• Manufacturer: FTDI

Specifications of FT245RQ-REEL

• Mounting Style: SMD/SMT
• Package / Case: QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.2 QFN-32 Package Dimensions
Figure 10.2 QFN-32 Package Dimensions
The FT245RQ is supplied in a RoHS compliant leadless QFN-32 package. The package is lead ( Pb ) free,
and uses a „green‟ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.
The centre pad on the base of the FT245RQ is not internally connected, and can be left unconnected, or
connected to ground (recommended).
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.
The code XXXXXXX is the manufacturing LOT code. This only applies to devices manufactured after April
2009.
Heat Sink
Central
Area
0.250 +/-0.050
Copyright © 2010 Future Technology Devices International Limited
( Laser Marked )
Indicates Pin # 1
0. 200
Dimensions in mm.
Note: The pin #1 ID is connected internally to the device’s central
heat sink area . It is recommended to ground the central heat sink
area of the device.
Pin # 1 ID
0. 500
1
8
8
7
6
5
4
3
2
1
FT245RQ
XXXXXXX
32
9
32
9
0.050
YYXX-A
10
31
5. 000 +/-0. 075
3. 200 +/-0. 100
FTDI
11
30
12
29
13
28
14
27
FT245R USB FIFO IC Datasheet Version 2.10
15
26
25
16
16
25
24
17
17
18
19
20
21
22
23
24
+/-0.100
0.500 +/-0.050
0. 900
0. 150 Max
0. 200 Min
Document No.: FT_000052
Clearance No.: FTDI# 39
30