CSBLA455KJ58-B0 Murata, CSBLA455KJ58-B0 Datasheet - Page 45

• Manufacturer Part Number: CSBLA455KJ58-B0
• Description: Resonators 455kHz 0.5%
• Manufacturer: Murata
• Series: CSBLAr

Specifications of CSBLA455KJ58-B0

• Tolerance: 0.5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 20 C to + 80 C
• Dimensions: 3.5 mm W x 7 mm L x 9 mm H
• Frequency: 455 KHz
• Frequency Tolerance: ± 0.5%
• Oscillator Mounting: Through Hole
• No. Of Pins: 2
• Features: Piezoelectric Ceramic
• Rohs Compliant: Yes
• Resonator Case: Radial Leaded
• Resonant Impedance: 30ohm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
CSBFB_J (430-519kHz/700-1250kHz)
1. Soldering Conditions
(1) Reflow
2. Wash
(1) Cleaning Solvents
(2) Temperature Difference : dT *1
(4) Drying
3. Notice for Mounting
(2) Soldering Iron
(3) Conditions
(5) Others
Soldering and Mounting
One heat stress, shown in the profile at right, is applied to
the resonator, then after being placed in natural conditions
for 1 hour, the resonator is measured.
(a) Pre-heating conditions should be +150 to +180 C for
(b) Heating conditions should be within 40 seconds at
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
dTV60 C (dT=Component-solvent)
*1 ex. In case the component at +90 C immerses into
5 minutes max. by air blow at +80 C max.
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
Components shall be measured after soldering on PCB
at +350 5 C for 3.0 0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.
(a) Ultrasonic Wash
(a) Please ensure the component is thoroughly evaluated
(b) Please do not apply excessive mechanical stress to
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1 minute max. in above solvent at +60 C max.
60 to 120 seconds. Ascending time up +150 C should
be longer than 30 seconds.
+230 C min., but peak temperature should be lower
than +260 C.
(Frequency: 28kHz, Output: 20W/l)
chlorine, petroleum, or alkali cleaning solvent.
in your application circuit.
the component and lead terminals during soldering.
cleaning solvent at +60 C, then dT=30 C.
Notice for General Usage -kHz Chip Type-
(b) Immersion Wash
(c) Shower or Rinse Wash
(c) Ultrasonic cleaning of the component is acceptable.
(c) In the case of the bulk component, dry heating
5 minutes max. in above solvent at +60 C max.
5 minutes max. in above solvent at +60 C max.
However, the size of bath, size and thickness of PCB
should be evaluated to confirm stable electrical
characteristics are maintained.
treatment (130 C. for 5 hours min.) is required before
reflow soldering. Then, the component should be
soldered within 48 hours after dry heating treatment.
230
180
150
30 sec.
min.
(150-180˚C)
Pre-heating
60-120 sec.
(260˚C max.)
Heating
(230˚C)
40 sec.
Peak
max.
Gradual
Cooling
120 sec.
min.
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P16E.pdf
10.12.7
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