XC3S1400AN-4FGG484C Xilinx Inc, XC3S1400AN-4FGG484C Datasheet
XC3S1400AN-4FGG484C
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XC3S1400AN-4FGG484C Summary of contents
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... Recommended Operating Conditions I/O Timing Configurable Logic Block (CLB) Timing Multiplier Timing Block RAM Timing Digital Clock Manager (DCM) Timing Suspend Mode Timing Device DNA Timing Configuration and JTAG Timing Status XC3S50AN Production XC3S200AN Production XC3S400AN Production XC3S700AN Production XC3S1400AN Production 1 ...
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... XC3S700AN 700K 13,248 1,472 XC3S1400AN 1400K 25,344 2,816 Notes convention, one Kb is equivalent to 1,024 bits and one Mb is equivalent to 1,024 Kb. © Copyright 2007–2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries ...
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... DCM IOBs Notes: 1. The XC3S700AN and XC3S1400AN have two additional DCMs on both the left and right sides as indicated by the dashed lines. The XC3S50AN has only two DCMs at the top and only one Block RAM/Multiplier column. DS557 (v4.1) April 1, 2011 Product Specification Spartan-3AN FPGA Family: Introduction and Ordering Information • ...
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... Part Number XC3S50AN XC3S200AN XC3S400AN XC3S700AN XC3S1400AN Notes: 1. Aligned to next available page location. After configuration, the FPGA design has full access to the in-system Flash memory via an internal SPI interface; the control logic is implemented with FPGA logic. Additionally, the FPGA application itself can store nonvolatile data or provide live, in-system Flash updates ...
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... XC3S50AN (7) XC3S200AN – XC3S400AN – XC3S700AN – XC3S1400AN – Notes: 1. See Pb and Pb-Free Packaging, page 7 2. The footprint for the TQ(G)144 ( mm) package is larger than the package body. 3. Each Spartan-3AN FPGA has a pin-compatible Spartan-3A FPGA equivalent, although Spartan-3A FPGAs do not have internal SPI flash and offer more part/package combinations ...
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Package Marking Figure 3 provides a top marking example for Spartan-3AN FPGAs in the quad-flat packages. Figure 4 marking for Spartan-3AN FPGAs in BGA packages. The markings for the BGA packages are nearly identical to those for the quad-flat packages, ...
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... C XC3S400AN - XC3S700AN - XC3S1400AN - Notes order a Pb package for the XC3S50AN -4 option, append SCD4100 to the part number (XC3S50AN-4TQ144C4100). 2. For Pb packaging for these options, contact your Xilinx sales representative. DS557 (v4.1) April 1, 2011 Product Specification Spartan-3AN FPGA Family: Introduction and Ordering Information ...
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... FGG484 FG676/ 676-ball Fine-Pitch Ball Grid Array (FBGA) FGG676 Revision Notice of Disclaimer. 2, revised the Maximum Differential I/O Pairs and Maximum User I/O values for the Table 4, added packages to the XC3S50AN, XC3S400AN, and XC3S1400AN. Updated section and Table 5 www.xilinx.com Temperature Range Commercial ( ...
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Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY ...
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DS557 (v4.1) April 1, 2011 Spartan-3AN FPGA Design Documentation The functionality of the Spartan®-3AN FPGA family is described in the following documents. The topics covered in each guide are listed below: • DS706: Extended Spartan-3A Family Overview • UG331: Spartan-3 ...
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... Added the FT(G)256 package selection for the XC3S50AN and XC3S400AN devices and the FG(G)484 package selection for the XC3S1400AN device throughout this data sheet. Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www ...
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DS557 (v4.1) April 1, 2011 DC Electrical Characteristics In this section, specifications can be designated as Advance, Preliminary, or Production. These terms are defined as follows: Advance: Initial estimates are based on simulation, early characterization, and/or extrapolation from the characteristics ...
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Power Supply Specifications Table 7: Supply Voltage Thresholds for Power-On Reset Symbol V Threshold for the V CCINTT V Threshold for the V CCAUXT V Threshold for the V CCO2T Notes: 1. When configuring from the In-System Flash, V reaches ...
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General Recommended Operating Conditions Table 10: General Recommended Operating Conditions Symbol T Junction temperature J V Internal supply voltage CCINT (1) V Output driver supply voltage CCO V Auxiliary supply voltage CCAUX (2) V Input voltage IN T Input signal ...
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General DC Characteristics for I/O Pins Table 11: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins Symbol Description (2) I Leakage current at User I/O, L Input-only, Dual-Purpose, and Dedicated pins, FPGA powered I Leakage current on pins ...
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... XC3S50AN 3.1 XC3S200AN 5.1 XC3S400AN 5.1 XC3S700AN 6.1 XC3S1400AN 10.1 Table 10. of 25° 3.6V. The FPGA is programmed with a “blank” configuration data file (that is, a design with no CCAUX provides quick, approximate, typical estimates, and does not require a netlist of the design, and b) www ...
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Single-Ended I/O Standards Table 13: Recommended Operating Conditions for User I/Os Using Single-Ended Standards V IOSTANDARD CCO Attribute Min (V) Nom (V) LVTTL 3.0 (4) LVCMOS33 3.0 (4)(5) LVCMOS25 2.3 LVCMOS18 1.65 LVCMOS15 1.4 LVCMOS12 1.1 (6) PCI33_3 3.0 (6) ...
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Table 14: DC Characteristics of User I/Os Using Single-Ended Standards Test Conditions IOSTANDARD Attribute (mA) (mA) (3) LVTTL 2 2 – – – – – –16 ...
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Differential I/O Standards Differential Input Pairs X-Ref Target - Figure 6 Internal Logic V INN V INP GND level Table 15: Recommended Operating Conditions for User I/Os Using Differential Signal Standards V CCO IOSTANDARD Attribute Min (V) (3) LVDS_25 2.25 ...
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Table 15: Recommended Operating Conditions for User I/Os Using Differential Signal Standards (Cont’d) V CCO IOSTANDARD Attribute Min (V) (8) DIFF_SSTL3_II 3.0 Notes: 1. The V rails supply only differential output drivers, not input circuits. CCO 2. V must be ...
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Table 16: DC Characteristics of User I/Os Using Differential Signal Standards IOSTANDARD Attribute Min (mV) LVDS_25 247 LVDS_33 247 BLVDS_25 240 MINI_LVDS_25 300 MINI_LVDS_33 300 RSDS_25 100 RSDS_33 100 TMDS_33 400 PPDS_25 100 PPDS_33 100 DIFF_HSTL_I_18 – DIFF_HSTL_II_18 – DIFF_HSTL_III_18 ...
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External Termination Requirements for Differential I/O LVDS, RSDS, MINI_LVDS, and PPDS I/O Standards X-Ref Target - Figure 3. 2.5V CCO CCO LVDS_33, LVDS_25, MINI_LVDS_33, MINI_LVDS_25, RSDS_33, RSDS_25, PPDS_33 PPDS_25 a) Input-only Differential Pairs or Pairs ...
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Device DNA Read Endurance Table 17: Device DNA Identifier Memory Characteristics Symbol Number of READ operations or JTAG ISC_DNA read operations. Unaffected by DNA_CYCLES HOLD or SHIFT operations In-System Flash Memory Data Retention, Program/Write Endurance Table 18: In-System Flash (ISF) ...
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... Xilinx development software) and back-annotated to the simulation netlist. Table 19: Spartan-3AN Family v1.41 Speed Grade Designations Device XC3S50AN XC3S200AN XC3S400AN XC3S700AN XC3S1400AN Table 20 provides the recent history of the Spartan-3AN speed files. Table 20: Spartan-3AN Speed File Version History Version 1.41 ISE 10.1.03 1.40 ISE 10 ...
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... XC3S200AN (3) rate, with DCM XC3S400AN XC3S700AN XC3S1400AN (2) LVCMOS25 , 12 mA XC3S50AN output drive, Fast slew XC3S200AN rate, without DCM XC3S400AN XC3S700AN XC3S1400AN Table 30 and are based on the operating conditions set forth in www.xilinx.com Speed Grade -5 -4 Units Max Max 3.18 3.42 ns 3.21 3. ...
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... XC3S700AN XC3S1400AN (3) LVCMOS25 , XC3S50AN IFD_DELAY_VALUE = 5, XC3S200AN without DCM XC3S400AN XC3S700AN XC3S1400AN Table 30 and are based on the operating conditions set forth in Table 26. If this is true of the data Input, add the Table 26. If this is true of the data Input, subtract the www.xilinx.com Speed Grade -5 -4 ...
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... Input pin to the active transition at the ICLK input of the Input Flip-Flop (IFF). The Input Delay is programmed. DS557 (v4.1) April 1, 2011 Product Specification Spartan-3AN FPGA Family: DC and Switching Characteristics IFD_ Conditions DELAY_ Device VALUE (2) LVCMOS25 0 XC3S50AN XC3S200AN XC3S400AN XC3S700AN XC3S1400AN (2) LVCMOS25 1 XC3S50AN XC3S200AN ...
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... DS557 (v4.1) April 1, 2011 Product Specification Spartan-3AN FPGA Family: DC and Switching Characteristics IFD_ Conditions DELAY_ Device VALUE (2) LVCMOS25 1 XC3S700AN XC3S1400AN (3) LVCMOS25 XC3S50AN XC3S200AN 0 XC3S400AN XC3S700AN XC3S1400AN (3) LVCMOS25 1 XC3S50AN XC3S200AN www.xilinx.com Speed Grade -5 -4 Units Min Min 1.82 1.95 ns 2.62 2.83 ns 3.32 3 ...
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... XC3S700AN –1.67 –1.67 2 –2.27 –2.27 3 –2.59 –2.59 4 –2.92 –2.92 5 –2.89 –2.89 6 –3.22 –3.22 7 –3.52 –3.52 8 –3.81 –3.81 1 XC3S1400AN –1.60 –1.60 2 –2.06 –2.06 3 –2.46 –2.46 4 –2.86 –2.86 5 –2.88 –2.88 6 –3.24 –3.24 7 –3.55 –3.55 8 –3.89 –3.89 – All 1.33 and are based on the operating conditions set forth in ...
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... Speed Grade Device Units -5 -4 Max Max XC3S50AN 1.04 1.12 ns XC3S200AN 0.87 0.87 ns XC3S400AN 0.65 0.72 ns XC3S700AN 0.92 0.92 ns XC3S1400AN 0.96 1.21 ns XC3S50AN 1.79 2.07 ns 2.13 2.46 ns 2.36 2.71 ns 2.88 3.21 ns 3.11 3.46 ns 3.45 3.84 ns 3.75 4.19 ns 4.00 4. ...
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... XC3S700AN 1.84 1.87 ns 2.20 2.27 ns 2.46 2.60 ns 2.93 3.15 ns 3.21 3.45 ns 3.54 3.80 ns 3.86 4.16 ns 4.13 4.48 ns 3.82 4.19 ns 4.17 4.58 ns 4.43 4.89 ns 4.95 5.49 ns 5.22 5.83 ns 5.57 6.21 ns 5.89 6.55 ns 6.16 6.89 ns XC3S1400AN 1.95 2.18 ns 2.29 2.59 ns 2.54 2.84 ns 2.96 3. ...
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... Max Max XC3S1400AN 3.17 3.52 ns 3.52 3.92 ns 3.82 4.18 ns 4.10 4.57 ns 3.84 4.31 ns 4.20 4.79 ns 4.46 5.06 ns 4.87 5.51 ns 5.07 5.73 ns 5.43 6.08 ns 5.73 6.33 ns 6.01 6.77 ns XC3S50AN 1.70 1.81 ns XC3S200AN 1.85 2.04 ns XC3S400AN 1.44 1.74 ns XC3S700AN 1.48 1.74 ns XC3S1400AN 1.50 1. ...
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Table 25: Propagation Times for the IOB Input Path (Cont’d) Symbol Description T The time it takes for data to travel IOPLID from the Input pin through the IFF latch to the I output with the input delay programmed DS557 ...
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... Spartan-3AN FPGA Family: DC and Switching Characteristics Conditions DELAY_VALUE (2) LVCMOS25 Table 30 and are based on the operating conditions set forth in Table 26. www.xilinx.com Speed Grade Device Units -5 -4 Max Max XC3S1400AN 1.93 2.40 ns 2.69 3.15 ns 3.52 3.99 ns 3.89 4.55 ns 3.95 4.42 ns 4.53 5.32 ns 5.30 6.21 ns 5.83 6. ...
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Input Timing Adjustments Table 26: Input Timing Adjustments by IOSTANDARD Convert Input Time from Adjustment Below LVCMOS25 to the Following Signal Standard Speed Grade (IOSTANDARD) -5 Single-Ended Standards LVTTL 0.62 LVCMOS33 0.54 LVCMOS25 0 LVCMOS18 0.83 LVCMOS15 0.60 LVCMOS12 0.31 ...
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Output Propagation Times Table 27: Timing for the IOB Output Path Symbol Description Clock-to-Output Times T When reading from the Output IOCKP Flip-Flop (OFF), the time from the active transition at the OCLK input to data appearing at the Output ...
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Three-State Output Propagation Times Table 28: Timing for the IOB Three-State Path Symbol Description Synchronous Output Enable/Disable Times T Time from the active transition at the OTCLK IOCKHZ input of the Three-state Flip-Flop (TFF) to when the Output pin enters ...
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Output Timing Adjustments Table 29: Output Timing Adjustments for IOB Convert Output Time from Adjustment Below LVCMOS25 with 12 mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) Single-Ended Standards LVTTL Slow ...
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Table 29: Output Timing Adjustments for IOB Convert Output Time from Adjustment Below LVCMOS25 with 12 mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) LVCMOS25 Slow 2.82 8 ...
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Table 29: Output Timing Adjustments for IOB Convert Output Time from Adjustment Below LVCMOS25 with 12 mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) LVCMOS12 Slow 5.67 Fast ...
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Timing Measurement Methodology When measuring timing parameters at the programmable I/Os, different signal standards call for different test conditions. Table 30 lists the conditions to use for each standard. The method for measuring Input timing is as follows: A signal ...
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Table 30: Test Methods for Timing Measurement at I/Os (Cont’d) Signal Standard (IOSTANDARD) V REF Differential LVDS_25 – LVDS_33 – BLVDS_25 – MINI_LVDS_25 – MINI_LVDS_33 – LVPECL_25 – LVPECL_33 – RSDS_25 – RSDS_33 – TMDS_33 – PPDS_25 – PPDS_33 – ...
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... Ball grid array packages are recommended for applications with a large number of simultaneously switching outputs. Table 31: Equivalent V Device XC3S50AN XC3S200AN XC3S400AN XC3S700AN XC3S1400AN CCO www.xilinx.com and Table 32 provide the essential SSO /GND pairs. The CCO Table 32 ...
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Table 32: Recommended Number of Simultaneously Switching Outputs per V -GND Pair CCO TQG144 Signal Standard (IOSTANDARD) Top, Bottom Banks 0,2 Banks 1,3 Single-Ended Standards LVTTL Slow ...
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Table 32: Recommended Number of Simultaneously Switching Outputs per V -GND Pair (Cont’d) CCO TQG144 Signal Standard (IOSTANDARD) Top, Bottom Banks 0,2 Banks 1,3 LVCMOS25 Slow – 24 – ...
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Table 32: Recommended Number of Simultaneously Switching Outputs per V -GND Pair (Cont’d) CCO TQG144 Signal Standard (IOSTANDARD) Top, Bottom Banks 0,2 Banks 1,3 LVCMOS12 Slow – 6 – Fast – 6 – QuietIO ...
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Configurable Logic Block (CLB) Timing Table 33: CLB (SLICEM) Timing Symbol Clock-to-Output Times T When reading from the FFX (FFY) Flip-Flop, the time CKO from the active transition at the CLK input to data appearing at the XQ (YQ) output ...
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Table 34: CLB Distributed RAM Switching Characteristics Symbol Clock-to-Output Times T Time from the active edge at the CLK input to data appearing on SHCKO the distributed RAM output Setup Times T Setup time of data at the BX or ...
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Clock Buffer/Multiplexer Switching Characteristics Table 36: Clock Distribution Switching Characteristics Description Global clock buffer (BUFG, BUFGMUX, BUFGCE) I input to O-output delay Global clock multiplexer (BUFGMUX) select S-input setup to I0 and I1 inputs. Same as BUFGCE enable CE-input Frequency ...
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Embedded Multiplier Timing Table 37 Embedded Multiplier Timing Symbol Combinatorial Delay T Combinational multiplier propagation delay from the A and B inputs MULT to the P outputs, assuming 18-bit inputs and a 36-bit product ...
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Block RAM Timing Table 38: Block RAM Timing Symbol Clock-to-Output Times T When reading from block RAM, the delay from the active RCKO transition at the CLK input to data appearing at the DOUT output Setup Times T Setup time ...
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Digital Clock Manager (DCM) Timing For specification purposes, the DCM consists of three key components: the Delay-Locked Loop (DLL), the Digital Frequency Synthesizer (DFS), and the Phase Shifter (PS). Aspects of DLL operation play a role in all DCM applications. ...
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Table 40: Switching Characteristics for the DLL Symbol Output Frequency Ranges CLKOUT_FREQ_CLK0 Frequency for the CLK0 and CLK180 outputs CLKOUT_FREQ_CLK90 Frequency for the CLK90 and CLK270 outputs CLKOUT_FREQ_2X Frequency for the CLK2X and CLK2X180 outputs CLKOUT_FREQ_DV Frequency for the CLKDV ...
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Table 40: Switching Characteristics for the DLL (Cont’d) Symbol Delay Lines (5) DCM_DELAY_STEP Finest delay resolution, average over all taps Notes: 1. The numbers in this table are based on the operating conditions set forth in 2. Indicates the maximum ...
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Table 42: Switching Characteristics for the DFS Symbol Output Frequency Ranges CLKOUT_FREQ_FX Frequency for the CLKFX and CLKFX180 outputs (2)(3) Output Clock Jitter CLKOUT_PER_JITT_FX Period jitter at the CLKFX and CLKFX180 outputs. (4)(5) Duty Cycle CLKOUT_DUTY_CYCLE_FX Duty cycle precision for ...
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Phase Shifter (PS) Table 43: Recommended Operating Conditions for the PS in Variable Phase Mode Symbol Operating Frequency Ranges PSCLK_FREQ (F ) Frequency for the PSCLK input PSCLK Input Pulse Requirements PSCLK_PULSE PSCLK pulse width as a percentage of the ...
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DNA Port Timing Table 46: DNA_PORT Interface Timing Symbol T Setup time on SHIFT before the rising edge of CLK DNASSU T Hold time on SHIFT after the rising edge of CLK DNASH T Setup time on DIN before the ...
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... XC3S50AN 2 4 XC3S200AN XC3S400AN XC3S700AN 3 6 XC3S1400AN XC3S50AN 13 32 XC3S200AN XC3S400AN XC3S700AN 15 35 XC3S1400AN XC3S50AN 14 35 XC3S200AN XC3S400AN XC3S700AN XC3S1400AN 17 40 XC3S50AN 15 35 XC3S200AN 30 75 XC3S400AN XC3S700AN 45 100 XC3S1400AN XC3S50AN 0.8 2.5 XC3S200AN 1.6 5 XC3S400AN XC3S700AN XC3S1400AN Units µs µ ...
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Suspend Mode Timing X-Ref Target - Figure 12 Entering Suspend Mode SUSPEND Input AWAKE Output Flip-Flops, Block RAM, Distributed RAM FPGA Outputs FPGA Inputs, Interconnect Table 49: Suspend Mode Timing Parameters Symbol Entering Suspend Mode T Rising edge of SUSPEND ...
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... T ICCK DS557-3_01_052908 , V , and CCINT CCAUX All Speed Grades Device Min Max All – 18 All 0.5 – XC3S50AN – 0.5 XC3S200AN – 0.5 XC3S400AN – 1 XC3S700AN – 2 XC3S1400AN – 2 All 250 – All 0.5 4 Units ms µ µ CCINT CCO 60 ...
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Configuration Clock (CCLK) Characteristics Table 51: Master Mode CCLK Output Period by ConfigRate Option Setting Symbol Description CCLK clock period by T ConfigRate setting CCLK1 T CCLK3 T CCLK6 T CCLK7 T CCLK8 T CCLK10 T CCLK12 T CCLK13 T ...
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Table 52: Master Mode CCLK Output Frequency by ConfigRate Option Setting Symbol Description Equivalent CCLK clock frequency F by ConfigRate setting CCLK1 F CCLK3 F CCLK6 F CCLK7 F CCLK8 F CCLK10 F CCLK12 F CCLK13 F CCLK17 F CCLK22 ...
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Table 54: Slave Mode CCLK Input Low and High Time Symbol T CCLK Low and High time SCCL, T SCCH Master Serial and Slave Serial Mode Timing X-Ref Target - Figure 14 PROG_B (Input) INIT_B (Open-Drain) CCLK (Input/Output) DIN (Input) ...
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Slave Parallel Mode Timing X-Ref Target - Figure 15 PROG_B (Input) INIT_B (Open-Drain) CSI_B (Input) RDWR_B (Input) CCLK (Input (Inputs) Notes possible to abort configuration by pulling CSI_B Low in a given CCLK cycle, ...
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External Serial Peripheral Interface (SPI) Configuration Timing X-Ref Target - Figure 16 PROG_B (Input) PUDC_B PUDC_B must be stable before INIT_B goes High and constant throughout the configuration process. (Input) VS[2:0] <1:1:1> (Input) M[2:0] <0:0:1> (Input) T MINIT INIT_B (Open-Drain) ...
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Table 58: Configuration Timing Requirements for Attached SPI Serial Flash Symbol T SPI serial Flash PROM chip-select time CCS T SPI serial Flash PROM data input setup time DSU T SPI serial Flash PROM data input hold time DH T ...
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Table 59: Timing for Byte-wide Peripheral Interface (BPI) Configuration Mode Symbol T Initial CCLK clock period CCLK1 T CCLK clock period after FPGA loads ConfigRate setting CCLKn T Setup time on M[2:0] mode pins before the rising edge of INIT_B ...
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... Configuration commands (CFG_IN, ISC_PROGRAM) All functions except ISC_DNA command During ISC_DNA command All operations on XC3S50AN, XC3S200AN, and XC3S400AN FPGAs and for BYPASS or HIGHZ instructions on all FPGAs All operations on XC3S700AN and XC3S1400AN FPGAs, except for BYPASS or HIGHZ instructions Table www.xilinx.com All Speed Grades ...
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... Updated link to sign up for Alerts and updated 04/01/11 4.1 In Table package and the XC3S1400AN in the FG(G)484 package. DS557 (v4.1) April 1, 2011 Product Specification Spartan-3AN FPGA Family: DC and Switching Characteristics Table 17 since number of Read cycles is the only unique limit. Updated Setup, Hold, and ...
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Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY ...
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DS557 (v4.1) April 1, 2011 Introduction This section describes how the various pins on a Spartan®-3AN FPGA connect within the supported component packages, and provides device-specific thermal characteristics. For general information on the pin functions and the package characteristics, see ...
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Table 62: Types of Pins on Spartan-3AN FPGAs (Cont’d) Type with Color Code Dedicated configuration pin, two per device. Not available as a user-I/O pin. Every package has two dedicated configuration pins. These pins are powered by VCCAUX. See UG332: ...
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... XC3S400AN FGG400 311 XC3S700AN FGG484 372 FGG484 375 XC3S1400AN FGG676 502 Notes: 1. Some VREFs are on INPUT pins. See pinout tables for details. Electronic versions of the package pinout tables and foot-prints are available for download from the Xilinx website at: http://www.xilinx.com/support/documentation/data_sheets/s3a_pin.zip Using a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file is easily parsed by most scripting programs ...
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... Device Package TQG144 XC3S50AN FTG256 XC3S200AN FTG256 FTG256 XC3S400AN FGG400 XC3S700AN FGG484 FGG484 XC3S1400AN FGG676 Notes: 1. Thermal characteristics are similar for leaded (non-Pb-free) packages. 2. Use the Thermal Query tool at http://www.xilinx.com/cgi-bin/thermal/thermal.pl DS557 (v4.1) April 1, 2011 Product Specification Xilinx website MDDS PK169_TQ144 ...
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TQG144: 144-lead Thin Quad Flat Package The XC3S50AN is available in the 144-lead thin quad flat package, TQG144. Table 68 lists all the package pins. They are sorted by bank number and then by pin name. Pins that form a ...
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Table 68: Spartan-3AN TQG144 Pinout (Cont’d) Bank Pin Name 2 IO_L05P_2 2 IO_L06N_2/D6 2 IO_L06P_2 2 IO_L07N_2/D4 2 IO_L07P_2/D5 2 IO_L08N_2/GCLK15 2 IO_L08P_2/GCLK14 2 IO_L09N_2/GCLK1 2 IO_L09P_2/GCLK0 2 IO_L10N_2/GCLK3 2 IO_L10P_2/GCLK2 2 IO_L11N_2/DOUT 2 IO_L11P_2/AWAKE 2 IO_L12N_2/D3 2 IO_L12P_2/INIT_B 2 ...
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User I/Os by Bank Table 69 indicates how the 108 available user-I/O pins are distributed between the four I/O banks on the TQG144 package. The AWAKE pin is counted as a dual-purpose I/O. Table 69: User I/Os Per Bank for ...
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TQG144 Footprint Note: Pin 1 indicator in top-left corner and logo orientation. X-Ref Target - Figure 19 TMS 1 TDI 2 X IO_L02P_3 3 IO_L01P_3 4 IO_L02N_3 5 IO_L01N_3 6 IO_L03P_3 7 IO_L03N_3 8 GND 9 IO_L04P_3 10 IO_L04N_3/VREF_3 11 ...
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FTG256: 256-Ball Fine-Pitch, Thin Ball Grid Array The 256-ball fine-pitch, thin ball grid array package, FTG256, supports the XC3S50AN, XC3S200AN, and XC3S400AN devices. Table 70 lists all the package pins for these devices. They are sorted by bank number and ...
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Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name 0 N.C. 0 N.C. 0 IO_L15N_0 0 IO_L15P_0 0 IO_L16N_0 0 IO_L16P_0 0 IO_L17N_0 0 IO_L17P_0 0 IO_L18N_0 0 IO_L18P_0 0 IO_L19N_0 0 IO_L19P_0 0 IO_L20N_0/PUDC_B 0 ...
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Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name 1 IO_L10P_1 1 IO_L11N_1/RHCLK1 1 IO_L11P_1/RHCLK0 1 IO_L12N_1/TRDY1/RHCLK3 1 IO_L12P_1/RHCLK2 1 IO_L14N_1/RHCLK5 1 IO_L14P_1/RHCLK4 1 IO_L15N_1/RHCLK7 1 IO_L15P_1/IRDY1/RHCLK6 1 N.C. 1 N.C. 1 N.C. 1 N.C. 1 ...
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Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name 2 IO_L01N_2/M0 2 IO_L01P_2/M1 2 IO_L02N_2/CSO_B 2 IO_L02P_2/M2 2 IO_L04P_2/VS2 2 IO_L03P_2/RDWR_B 2 IO_L04N_2/VS0 2 IO_L03N_2/VS1 2 IO_L06P_2 2 IO_L05P_2 2 IO_L06N_2/D6 2 IO_L05N_2/D7 2 N.C. 2 ...
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Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name 2 IP_2 2 IP_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 VCCO_2 2 VCCO_2 2 VCCO_2 2 VCCO_2 3 IO_L01N_3 3 ...
Page 84
Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name 3 N.C. 3 N.C. 3 N.C. 3 N.C. 3 IO_L20N_3 3 IO_L20P_3 3 IO_L22N_3 3 IO_L22P_3 3 IO_L23N_3 3 IO_L23P_3 3 IO_L24N_3 3 IO_L24P_3 3 IP_L04N_3/VREF_3 3 ...
Page 85
Table 70: Spartan-3AN FTG256 Pinout (XC3S50AN, XC3S200AN, XC3S400AN) (Cont’d) Bank XC3S50AN Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND ...
Page 86
User I/Os by Bank Table 71 and Table 72 indicate how the available user-I/O pins are distributed between the four I/O banks on the FTG256 package. The AWAKE pin is counted as a dual-purpose I/O. The XC3S50AN FPGA in the ...
Page 87
Footprint Migration Differences Unconnected Balls on XC3S50AN Table 73 summarizes any footprint and functionality differences between the XC3S50AN and the XC3S200AN or XC3S400AN devices for migration between these devices in the FTG256 package. The XC3S200AN and XC3S400AN have identical pinouts. ...
Page 88
Table 73: FTG256 XC3S50AN Footprint Migration/Differences (Cont’d) FTG256 Ball Bank K13 N.C. L13 1 N.C. L14 1 N.C. L16 1 N. N.C. M10 2 N.C. ...
Page 89
XC3S50AN Differential I/O Alignment Differences Also, some differential I/O pairs on the XC3S50AN FPGA are aligned differently than the corresponding pairs on the XC3S200AN or XC3S400AN FPGAs, as shown in pair is shaded. Table 74: Differential I/O Differences in FTG256 ...
Page 90
FTG256 Footprint (XC3S50AN) (Differential Outputs I/O I/O A GND L19P_0 L18P_0 I/O I/O B TDI TMS L19N_0 L18N_0 I/O I/O I/O C GND L20P_0 L01N_3 L01P_3 VREF_0 I/O I/O I/O D VCCO_3 L03P_3 L02N_3 L02P_3 I/O ...
Page 91
FTG256 Footprint (XC3S200AN, XC3S400AN) X-Ref Target - Figure I/O I/O A GND L19P_0 L18P_0 I/O I/O B TDI TMS L19N_0 L18N_0 I/O I/O I/O C GND L20P_0 L01N_3 L01P_3 VREF_0 I/O I/O I/O D VCCO_3 ...
Page 92
FGG400: 400-Ball Fine-Pitch Ball Grid Array The 400-ball fine-pitch ball grid array, FGG400, supports the XC3S400AN FPGA as shown in Table 76 lists all the FGG400 package pins. They are sorted by bank number and then by pin name. Pins ...
Page 93
Table 76: Spartan-3AN FGG400 Pinout (Cont’d) Bank Pin Name 0 IO_L32N_0/PUDC_B 0 IO_L32P_0/VREF_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0 0 IP_0/VREF_0 0 ...
Page 94
Table 76: Spartan-3AN FGG400 Pinout (Cont’d) Bank Pin Name 1 IO_L38P_1/A24 1 IP_1/VREF_1 1 IP_L04N_1/VREF_1 1 IP_L04P_1 1 IP_L11N_1/VREF_1 1 IP_L11P_1 1 IP_L15N_1 1 IP_L15P_1/VREF_1 1 IP_L19N_1 1 IP_L19P_1 1 IP_L23N_1 1 IP_L23P_1/VREF_1 1 IP_L27N_1 1 IP_L27P_1 1 IP_L31N_1 1 ...
Page 95
Table 76: Spartan-3AN FGG400 Pinout (Cont’d) Bank Pin Name 2 IO_L28P_2 2 IO_L29N_2 2 IO_L29P_2 2 IO_L30N_2 2 IO_L30P_2 2 IO_L31N_2 2 IO_L31P_2 2 IO_L32N_2/CCLK 2 IO_L32P_2/D0/DIN/MISO 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 ...
Page 96
Table 76: Spartan-3AN FGG400 Pinout (Cont’d) Bank Pin Name 3 IO_L34P_3 3 IO_L36N_3 3 IO_L36P_3 3 IO_L37N_3 3 IO_L37P_3 3 IO_L38N_3 3 IO_L38P_3 3 IP_3 3 IP_L04N_3/VREF_3 3 IP_L04P_3 3 IP_L11N_3/VREF_3 3 IP_L11P_3 3 IP_L15N_3 3 IP_L15P_3 3 IP_L19N_3 3 ...
Page 97
Table 76: Spartan-3AN FGG400 Pinout (Cont’d) Bank Pin Name VCCAUX TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT ...
Page 98
FGG400 Footprint X-Ref Target - Figure 22 Left Half of FGG400 Package (Top View) I/O: Unrestricted, 155 general-purpose user I/O INPUT: Unrestricted, 46 general-purpose input pin DUAL: Configuration pins, 51 then possible user I/O VREF: User I/O or input 26 ...
Page 99
Bank I/O I/O I/O GND VCCAUX L13N_0 L07N_0 L08N_0 I/O I/O I/O I/O GND L14P_0 L13P_0 L11P_0 L08P_0 I/O I/O I/O I/O I/O L10N_0 L14N_0 L11N_0 L07P_0 L06N_0 VREF_0 I/O I/O I/O I/O VCCO_0 ...
Page 100
... FGG484: 484-Ball Fine-Pitch Ball Grid Array The 484-ball fine-pitch ball grid array, FGG484, supports both the XC3S700AN and the XC3S1400AN FPGAs. There are three pinout differences, as described in Table 78 lists all the FGG484 package pins. They are sorted by bank number and then by pin name. Pins that form a differential I/O pair appear together in the table ...
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Table 78: Spartan-3AN FGG484 Pinout (Cont’d) Bank Pin Name 0 IO_L29N_0 0 IO_L29P_0 0 IO_L30N_0 0 IO_L30P_0 0 IO_L31N_0 0 IO_L31P_0 0 IO_L32N_0 0 IO_L32P_0 0 IO_L33N_0 0 IO_L33P_0 0 IO_L34N_0 0 IO_L34P_0 0 IO_L35N_0 0 IO_L35P_0 0 IO_L36N_0/PUDC_B 0 ...
Page 102
Table 78: Spartan-3AN FGG484 Pinout (Cont’d) Bank Pin Name 1 IO_L25N_1/RHCLK7 1 IO_L25P_1/IRDY1/RHCLK6 1 IO_L26N_1/A11 1 IO_L26P_1/A10 1 IO_L28N_1 1 IO_L28P_1 1 IO_L29N_1/A13 1 IO_L29P_1/A12 1 IO_L30N_1/A15 1 IO_L30P_1/A14 1 IO_L32N_1 1 IO_L32P_1 1 IO_L33N_1/A17 1 IO_L33P_1/A16 1 IO_L34N_1/A19 1 ...
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... XC3S700AN: N.C. ◆ IP_2 U8 IP_2 V7 IP_2/VREF_2 R12 IP_2/VREF_2 R13 IP_2/VREF_2 R14 IP_2/VREF_2 T10 IP_2/VREF_2 T11 IP_2/VREF_2 T15 IP_2/VREF_2 T16 IP_2/VREF_2 T7 XC3S1400AN: IP_2/VREF_2 T8 XC3S700AN: N.C. ◆ IP_2/VREF_2 V8 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DUAL DUAL INPUT ...
Page 104
Table 78: Spartan-3AN FGG484 Pinout (Cont’d) Bank Pin Name 2 VCCO_2 2 VCCO_2 2 VCCO_2 2 VCCO_2 2 VCCO_2 2 VCCO_2 3 IO_L01N_3 3 IO_L01P_3 3 IO_L02N_3 3 IO_L02P_3 3 IO_L03N_3 3 IO_L03P_3 3 IO_L05N_3 3 IO_L05P_3 3 IO_L06N_3 3 ...
Page 105
Table 78: Spartan-3AN FGG484 Pinout (Cont’d) Bank Pin Name 3 IP_L04N_3/VREF_3 3 IP_L04P_3 3 IP_L11N_3 3 IP_L11P_3 3 IP_L15N_3/VREF_3 3 IP_L15P_3 3 IP_L19N_3 3 IP_L19P_3 3 IP_L23N_3 3 IP_L23P_3 3 IP_L27N_3 3 IP_L27P_3 3 IP_L31N_3 3 IP_L31P_3 3 IP_L35N_3 3 ...
Page 106
Table 78: Spartan-3AN FGG484 Pinout (Cont’d) Bank Pin Name VCCAUX DONE VCCAUX PROG_B VCCAUX TCK VCCAUX TDI VCCAUX TDO VCCAUX TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX ...
Page 107
... Table 79: User I/Os Per Bank for the XC3S700AN in the FGG484 Package Package I/O Bank Maximum I/Os Edge Top 0 Right 1 Bottom 2 Left 3 Total Table 80: User I/Os Per Bank for the XC3S1400AN in the FGG484 Package Package I/O Bank Maximum I/Os Edge Top 0 Right 1 Bottom 2 Left 3 Total ...
Page 108
FGG484 Footprint X-Ref Target - Figure 23 Left Half of FGG484 Package (Top View) I/O: Unrestricted, general-purpose user I/O 195 INPUT: Unrestricted, 60- general-purpose input pin 62 DUAL: Configuration pins, then possible user I/O 51 VREF: User I/O or input ...
Page 109
Bank I/O I/O I/O I/O I/O I/O L18P_0 L12N_0 L16N_0 L13N_0 L12P_0 L10N_0 GCLK6 VREF_0 I/O I/O I/O GND GND VCCO_0 L16P_0 L13P_0 L10P_0 I/O I/O I/O I/O I/O I/O L17P_0 L15N_0 L09P_0 ...
Page 110
... FGG676: 676-Ball Fine-Pitch Ball Grid Array The 676-ball fine-pitch ball grid array, FGG676, supports the XC3S1400AN FPGA. Table 82 lists all the FGG676 package pins. They are sorted by bank number and then by pin name. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type (as ...
Page 111
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 0 IO_L33N_0 0 IO_L33P_0 0 IO_L34N_0 0 IO_L34P_0 0 IO_L35N_0 0 IO_L35P_0 0 IO_L36N_0 0 IO_L36P_0 0 IO_L37N_0 0 IO_L37P_0 0 IO_L38N_0 0 IO_L38P_0 0 IO_L39N_0 0 IO_L39P_0 0 IO_L40N_0 0 ...
Page 112
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 1 IO_L02P_1/LDC1 1 IO_L03N_1/A1 1 IO_L03P_1/A0 1 IO_L04N_1 1 IO_L04P_1 1 IO_L05N_1 1 IO_L05P_1 1 IO_L06N_1 1 IO_L06P_1 1 IO_L07N_1/VREF_1 1 IO_L07P_1 1 IO_L08N_1 1 IO_L08P_1 1 IO_L09N_1 1 IO_L09P_1 1 ...
Page 113
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 1 IO_L51P_1 1 IO_L53N_1 1 IO_L53P_1 1 IO_L54N_1 1 IO_L54P_1 1 IO_L55N_1 1 IO_L55P_1 1 IO_L56N_1 1 IO_L56P_1 1 IO_L57N_1 1 IO_L57P_1 1 IO_L58N_1 1 IO_L58P_1/VREF_1 1 IO_L59N_1 1 IO_L59P_1 1 ...
Page 114
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 2 IO_L15N_2 2 IO_L15P_2 2 IO_L16N_2 2 IO_L16P_2 2 IO_L17N_2/VS2 2 IO_L17P_2/RDWR_B 2 IO_L18N_2 2 IO_L18P_2 2 IO_L19N_2/VS0 2 IO_L19P_2/VS1 2 IO_L20N_2 2 IO_L20P_2 2 IO_L21N_2 2 IO_L21P_2 2 IO_L22N_2/D6 2 ...
Page 115
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 IP_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 IP_2/VREF_2 2 ...
Page 116
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 3 IO_L30N_3 3 IO_L30P_3 3 IO_L31N_3 3 IO_L31P_3 3 IO_L32N_3/LHCLK1 3 IO_L32P_3/LHCLK0 3 IO_L33N_3/IRDY2/LHCLK3 3 IO_L33P_3/LHCLK2 3 IO_L34N_3/LHCLK5 3 IO_L34P_3/LHCLK4 3 IO_L35N_3/LHCLK7 3 IO_L35P_3/TRDY2/LHCLK6 3 IO_L36N_3 3 IO_L36P_3/VREF_3 3 IO_L37N_3 3 ...
Page 117
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name 3 IP_L58N_3/VREF_3 3 IP_L58P_3 3 IP_L62N_3 3 IP_L62P_3 3 IP_L66N_3/VREF_3 3 IP_L66P_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 GND ...
Page 118
Table 82: Spartan-3AN FGG676 Pinout (Cont’d) Bank Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX SUSPEND VCCAUX DONE VCCAUX PROG_B VCCAUX ...
Page 119
... Left 3 Total Footprint Migration Differences The XC3S1400AN is the only Spartan-3AN FPGA offered in the FGG676 package. The XC3S1400AN FPGA is pin compatible with the Spartan-3A XC3S1400A FPGA in the FG(G)676 package, although the Spartan-3A FPGA requires an external configuration source. DS557 (v4.1) April 1, 2011 Product Specification ...
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FGG676 Footprint X-Ref Target - Figure 24 Left Half of FGG676 Package (Top View) I/O: Unrestricted, 313 general-purpose user I/O INPUT: Unrestricted, general-purpose input pin 67 DUAL: Configuration pins, then possible user I/O 51 SUSPEND: Dedicated SUSPEND and 2 dual-purpose ...
Page 121
Bank I/O I/O I/O I/O I/O GND INPUT L26N_0 L23N_0 L18N_0 L15N_0 L14N_0 GCLK7 I/O I/O I/O I/O I/O I/O VCCO_0 L26P_0 L14P_0 L23P_0 L19N_0 L18P_0 L15P_0 GCLK6 VREF_0 I/O I/O I/O ...
Page 122
... Upgraded 04/01/11 4.1 Updated the CLK description in XC3S50AN and XC3S400AN in the FT(G)256 package and the XC3S1400AN in the FG(G)484 package. In Mass column, and updated Note 1. In FGG676 link from PK111_FGG676, and the TQG144 link from PK126_TQG144. Completely replaced the section device/package combinations and new figures and tables. Revised U16, U7, and T8 in Table 80 DS557 (v4 ...
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Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY ...