STM32F103TBU6 STMicroelectronics, STM32F103TBU6 Datasheet - Page 81
STM32F103TBU6
Manufacturer Part Number
STM32F103TBU6
Description
IC ARM CORTEX MCU 128KB 36VFQFPN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103R8H6.pdf
(99 pages)
Specifications of STM32F103TBU6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN Exposed Pad
Core
ARM Cortex M3
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
For Use With
497-11038 - BOARD DEMO FUEL GAUGE STM32
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103TBU6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103TBU6
Manufacturer:
ST
Quantity:
20 000
STM32F103x8, STM32F103xB
Figure 44. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
1. Drawing is not to scale.
Table 53.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
Symbol
outline
LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
0.270
0.45
9.85
9.85
Min
Doc ID 13587 Rev 13
millimeters
1.085
10.00
10.00
0.30
0.50
7.20
7.20
0.80
1.40
Typ
1.700
10.15
10.15
0.80
0.55
Max
0.12
0.15
0.08
100
0.0106
0.0177
0.3878
0.3878
Min
Package characteristics
inches
0.0427
0.0118
0.0197
0.3937
0.2835
0.3937
0.2835
0.0315
0.0551
Typ
(1)
0.0669
0.0315
0.0217
0.3996
0.3996
0.0047
0.0059
0.0031
Max
81/99