MMA2301EG Freescale Semiconductor, MMA2301EG Datasheet - Page 7

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MMA2301EG

Manufacturer Part Number
MMA2301EG
Description
IC SENSOR ACCEL +/-200G 16-SOIC
Manufacturer
Freescale Semiconductor
Series
MMAr
Datasheet

Specifications of MMA2301EG

Axis
X or Y
Acceleration Range
±225g
Sensitivity
10mV/g
Voltage - Supply
4.75 V ~ 5.25 V
Output Type
Analog
Bandwidth
400Hz
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.50mm Width)
Package Type
SOIC
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Temperature (min)
-40C
Operating Temperature (max)
125C
Operating Temperature Classification
Automotive
Product Height (mm)
3.3mm
Mounting
Surface Mount
Pin Count
16
Sensing Axis
X
Acceleration
200 g
Supply Voltage (max)
7 V
Supply Voltage (min)
- 0.3 V
Supply Current
6 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free by exemption / RoHS Compliant
Interface
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMA2301EG
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MMA2301EG
Quantity:
11
Company:
Part Number:
MMA2301EG
Quantity:
11
Sensors
Freescale Semiconductor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Figure 6. Footprint SOIC-16 (Case 475-01)
2.03 mm
0.080 in.
9.65 mm
0.380 in.
footprint, the packages will self-align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
1.27 mm
0.610 mm
0.050 in.
0.024 in.
MMA2301KEG
7

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