LMC555CM National Semiconductor, LMC555CM Datasheet
LMC555CM
Specifications of LMC555CM
Available stocks
Related parts for LMC555CM
LMC555CM Summary of contents
Page 1
... Available in 8-pin MSOP Package and 8-Bump micro SMD package 866920 Package Marking Industrial −40°C to +85°C LMC555CM LMC555CM LMC555CMX LMC555CMM ZC5 LMC555CMMX LMC555CN LMC555CN LMC555CTP F02 LMC555CTPX 8669 November 8, 2010 866915 Transport Media NSC Drawing Rails M08A 2.5k Units Tape and Reel ...
Page 2
Connection Diagrams www.national.com 8-Pin SOIC, MSOP, MDIP Top View 8-Bump micro SMD Top View (Bump Side Down) 2 866901 866909 ...
Page 3
... Absolute Maximum Ratings 3) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Input Voltages TRIG RES CTRL V THRESH Output Voltages DIS Output Current DIS Storage Temperature Range Soldering specification for MDIP package: ...
Page 4
Symbol Parameter f Astable Frequency A f Maximum Frequency MAX Output Rise and R F Fall Times t Trigger Propagation Delay PD Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. ...
Page 5
Application Information MONOSTABLE OPERATION In this mode of operation, the timer functions as a one-shot (Figure 1). The external capacitor is initially held discharged by internal circuitry. Upon application of a negative trigger pulse of less than 1 ...
Page 6
Figure 5 shows the waveform generated in this mode of op- eration Top Trace: Output 5 V/Div. CC TIME = 20 µs/Div. Bottom Trace: Capacitor Voltage 1 V/Div 3.9 kΩ kΩ ...
Page 7
Top Trace: Modulation 1 V/Div. CC TIME = 0.2 ms/Div. Bottom Trace: Output Voltage 2 V/Div 9.1 kΩ 0.01 µF FIGURE 9. Pulse Width Modulator Waveforms PULSE POSITION MODULATOR This application uses ...
Page 8
Physical Dimensions 8-Pin (0.118” Wide) Molded Mini Small Outline Package www.national.com inches (millimeters) unless otherwise noted Molded Small Outline (SO) Package (M) NS Package Number M08A NS Package Number MUA08A 8 ...
Page 9
Molded Dual-in-line Package (N) NS Package Number N08E 9 www.national.com ...
Page 10
... NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH PACKAGE LENGTH AND X3 IS PACK- AGE HEIGHT ...
Page 11
Notes 11 www.national.com ...
Page 12
... For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Amplifiers www.national.com/amplifiers Audio www.national.com/audio Clock and Timing www.national.com/timing Data Converters www.national.com/adc Interface www.national.com/interface LVDS www.national.com/lvds Power Management www.national.com/power Switching Regulators www.national.com/switchers LDOs www.national.com/ldo LED Lighting www ...