LM95235CIMM National Semiconductor, LM95235CIMM Datasheet - Page 7

• Manufacturer Part Number: LM95235CIMM
• Description: IC,TEMPERATURE SENSOR,TSSOP,8PIN,PLASTIC
• Manufacturer: National Semiconductor

Specifications of LM95235CIMM

• Rohs Compliant: NO

Logic Electrical Characteristics
Notes
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the
listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: Thermal resistance junction-to-ambient when attached to a printed circuit board with 1 oz. foil and no airflow is:
Note 3: Human body model (HBM) is a charged 100 pF capacitor discharged into a 1.5 kΩ resistor. Machine model (MM), is a charged 200 pF capacitor discharged
directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated
assembler) then rapidly being discharged.
Note 4: When the input voltage (V
Parasitic components and or ESD protection circuitry are shown in the figures below for the LM95235’s pins. Care should be taken not to forward bias the parasitic
diodes on pins 2 and 3. Doing so by more than 50 mV may corrupt the temperature measurements. SNP refers to Snap-back device.
Note 5: Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.
Note 6: Typical figures are at T
guaranteed.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power
dissipation of the LM95235 and the thermal resistance. See (Note 2) for the thermal resistance to be used in the self-heating calculation.
Note 9: The accuracy of the LM95235 is guaranteed when using a typical thermal diode of an Intel processor on a 65 nm process or an MMBT3904
diode-connected transistor, as selected in the Remote Diode Model Select register. See typical performance curve for performance with Intel processor on a 90nm
process.
Note 10: This specification is provided only to indicate how often temperature data is updated. The LM95235 can be read at any time without regard to conversion
state (and will yield last conversion result).
Note 11: Quiescent current will not increase substantially when the SMBus is active.
Note 12: The output rise time is measured from (V
Note 13: The output fall time is measured from (V
Note 14: Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than t
SMBDAT and SMBCLK pins to a high impedance state.
Pin #
θ
JA
1
2
3
4
5
6
7
8
for MSOP-8 package = 210˚C/W
SMBDAT
SMBCLK
T_CRIT
OS/A0
Label
GND
V
D+
D−
DD
A
= 25˚C and represent most likely parametric norms at the time of product characterization. The typical specifications are not
I
) at any pin exceeds the power supplies (V
Circuit
IN(1)
B
A
A
C
B
C
C
C
IN(0)
min + 0.15V) to (V
max - 0.15V) to (V
(Continued)
IN(0)
IN(1)
max - 0.15V).
min + 0.15V).
I
<
7
GND or V
Circuit A
Circuit C
Pin ESD Protection Structure Circuits
TIMEOUT
I
>
V
DD
will reset the LM95235’s SMBus state machine, therefore setting
), the current at that pin should be limited to 5 mA.
Circuit B
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