PIC16F767-E/ML Microchip Technology, PIC16F767-E/ML Datasheet - Page 35

• Manufacturer Part Number: PIC16F767-E/ML
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,28PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F767-E/ML

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.0
4.1
The PIC16F7X7 can be operated in eight different oscil-
lator modes. The user can program three configuration
bits (FOSC2:FOSC0) to select one of these eight modes
(modes 5-8 are new PIC16 oscillator configurations):
1.
2.
3.
4.
5.
6.
7.
8.
4.2
In XT, LP or HS modes, a crystal or ceramic resonator
is connected to the OSC1/CLKI and OSC2/CLKO pins
to establish oscillation (see Figure 4-1 and Figure 4-2).
The PIC16F7X7 oscillator design requires the use of a
parallel cut crystal. Use of a series cut crystal may give
a frequency out of the crystal manufacturer’s
specifications.
FIGURE 4-1:
 2004 Microchip Technology Inc.
Note 1: See Table 4-1 for typical values of C1 and C2.
LP
XT
HS
RC
RCIO
INTIO1 Internal Oscillator with F
INTIO2 Internal Oscillator with I/O on RA6
ECIO
2: A series resistor (R
3: R
C1
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
C2
(1)
(1)
strip cut crystals.
between 2 M
F
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
External Resistor/Capacitor with
F
External Resistor/Capacitor with
I/O on RA6
output on RA6 and I/O on RA7
and RA7
External Clock with I/O on RA6
OSC
varies with the crystal chosen (typically
XTAL
R
S (2)
/4 output on RA6
OSC1
OSC2
CRYSTAL OPERATION
(HS, XT OR LP OSC
CONFIGURATION)
to 10 M
S
) may be required for AT
R
F
(3)
.
OSC
PIC16F7X7
/4
To Internal
Logic
Sleep
TABLE 4-1:
Capacitor values are for design guidance only.
These capacitors were tested with the crystals listed
below for basic start-up and operation. These values
were not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following this table for additional
information.
Osc Type
DD
Note 1: Higher capacitance increases the stability
HS
LP
XT
and temperature range for the application.
2: Since each crystal has its own character-
3: Rs may be required in HS mode, as well
4: Always verify oscillator performance over
of oscillator but also increases the
start-up time.
istics, the user should consult the crystal
manufacturer for appropriate values of
external components.
as XT mode, to avoid overdriving crystals
with low drive level specification.
the V
expected for the application.
200 kHz
200 kHz
20 MHz
Crystal
32 kHz
1 MHz
4 MHz
4 MHz
8 MHz
Freq
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR (FOR
DESIGN GUIDANCE ONLY)
DD
and temperature range that is
PIC16F7X7
Typical Capacitor Values
33 pF
15 pF
56 pF
15 pF
15 pF
15 pF
15 pF
15 pF
C1
Tested:
DS30498C-page 33
33 pF
15 pF
56 pF
15 pF
15 pF
15 pF
15 pF
15 pF
C2