CM75MXA-24S Powerex Inc, CM75MXA-24S Datasheet - Page 6

• Manufacturer Part Number: CM75MXA-24S
• Description: IGBT MODULE NX-SERIES CIB DP 1200 75
• Manufacturer: Powerex Inc
• Type: CIB Moduler

Specifications of CM75MXA-24S

• Voltage: 1200V
• Current: 75A
• Circuit Configuration: CIB Module
• Rohs Compliant: Yes
• Recommended Gate Driver: M57159L
• Recommended Dc To Dc Converter: VLA106-15242

6
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone] www.pwrx.com
CM75MXA-24S
NX-S Series CIB Module
(3Ø Converter + 3Ø Inverter + Brake)
75 Amperes/1200 Volts
Thermal Resistance Characteristics, T
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink
Mechanical Characteristics
Mounting Torque
Weight
Creepage Distance
Clearance
Flatness of Baseplate
Recommended Operating Conditons, T
(DC) Supply Voltage
Gate (-Emitter Drive) Voltage
External Gate Resistance
*2 Case temperature (T
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
(mounting side) of the baseplate and the heatsink side just under the chips.
*2
C
) and heatsink temperature (T
MOUNTING SIDE
MOUNTING SIDE
*2
*2
*2
*2
*2
s
) is measured on the surface
X
MOUNTING
R
R
R
R
R
V
R
Y
th(j-c)
th(j-c)
th(j-c)
th(j-c)
th(j-c)
GE(on)
SIDE
th(c-s)
V
R
M
d
d
e
m
+ : CONVEX
CC
– : CONCAVE
j
s
a
c
G
s
a
= 25°C unless otherwise specified
Q
Q
D
D
D
= 25°C
Converter Part ConvDi, per 1/6 Module
Per Inverter FWDi, per 1/6 Module
Applied Across GB-Es / G*P-*/ G*N-Es
Per Inverter IGBT, per 1/6 Module
Applied Across P-N/P1-N1 Terminals
Mounting to Heatsink, M5 Screw
Thermal Grease Applied,
Brake Part ClampDi
Terminal to Baseplate
Terminal to Baseplate
(* = U, V, W) Terminals
Brake Part IGBT
Terminal to Terminal
Terminal to Terminal
On Centerline X, Y
Inverter Part IGBT
Brake Part IGBT
per 1 Module
15.2
18.1
32.6
48.0
31.2
47.0
*7
0
Each mark points to the center position of each chip.
Tr*P / Tr*N / TrBr (* = U/V/W): IGBT
DiBr: Clamp Di
Th: NTC Thermistor
*8
54
55
56
57
58
59
60
61
Tr
Br
53
1
CR
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
RP
CR
RN
2
3
Di
Br
4 5
CR
SN
CR
SP
6
14.27
12.33
7
CR
TN
CR
TP
6.47
6.47
13.5
8.2
8
22
13
—
—
—
—
—
—
—
±0
—
9 10 11 12 13 14 15 16 17 18 19 20 21 22
UP
Tr
UN
UN
Di*P / Di*N (* = U/V/W): FWDi
CR*P / CR*N (* = R/S/T): Conv Di
Di
Tr
UP
Di
0.015
15.0
VP
300
600
VN
VN
Tr
Di
Tr
—
—
—
—
—
27
—
—
—
—
—
—
—
VP
Di
WN
Di
WP
Tr
WN
Tr
WP
Di
Th
LABEL SIDE
±100
0.25
0.40
0.35
0.63
0.24
16.5
850
130
30
29
28
27
26
25
24
23
31
82
—
—
—
—
—
—
0
17.2
19.4
24.6
25.6
35.9
42.5
46.2
05/11 Rev. 2
Grams
Volts
Volts
K/W
K/W
K/W
K/W
K/W
K/W
in-lb
mm
mm
mm
mm
µm
Ω
Ω