ADNK-7633 Avago Technologies US Inc., ADNK-7633 Datasheet - Page 10

• Manufacturer Part Number: ADNK-7633
• Description: A7630 Reference Design Kit
• Manufacturer: Avago Technologies US Inc.
• Type: Transceiver, Bluetooth 2.1+EDRr

Specifications of ADNK-7633

• Frequency: 2.4GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Refer to Figure 7 and Table 2 for the recommended solder reflow profile for PCB using Pb-free solder paste LF310.
Table 2. Recommended Solder Reflow Profile
Figure 7. Solder Reflow Profile for PCB
Critical and Non-critical Areas of QFN Soldering
As ADNS-7630 is a QFN package, it is designed to be a con-
tact-down package. Refer to Figure 7 and 8 on the critical
and non-critical areas for QFN soldering. The critical area
for soldering ADNS-7630 is on the terminal undersides,
while the terminal sides are deemed as non-critical area,
and thus not intended to be wettable. The non-wetting
Figure 8. Critical and Non-critical areas (Bottom view)
10
Description
Max Ramp-Up Rate,
Max Ramp-Down Rate,
Preheat temperature minimum, Tsmin
Preheat temperature maximum, Tsmax
Preheat Duration(Tsmin to Tsmax), t
Liquidus Temperature, T
Time Above Reflow (T
Peak Temperature, Tp
Time within 5°C of the specified classification temperature (Tc=250°C ), tp
Time 25°C to peak temperature
T
T
25
P
L
Terminal Undersides
T
T
smax
smin
(Critical area)
Max. Ramp - Up Rate = 3°C/sec
Max Ramp - Down Rate = 6°C/sec
Preheat Area
L
=220°C), t
Time 25°C to Peak
L
t
Time (second)
s
s
t
t
p
of the terminal sides are due to exposed copper on the
package side (which is expected and accepted), occurred
after the singulation step, which is a standard process in
QFN assembly. This is inline with the Industry Standard
(for more information, please refer to IPC-A-610D: Accept-
ability of Electronics Assemblies).
T
c
(Non-critical area)
-5°C
Terminal Sides
Specification
3°C/sec
6°C /sec
150°C
200°C
60-120 sec
220°C
30-90 sec
250°C
10 sec
8 mins maximum