AMMP-6546-TR1G Avago Technologies US Inc., AMMP-6546-TR1G Datasheet - Page 6

• Manufacturer Part Number: AMMP-6546-TR1G
• Description: SubHarmonic Mixer 18-40GHz MMIC
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6546-TR1G

• Rf Type: DBS, LMDS, VSAT
• Frequency: 18GHz ~ 40GHz
• Number Of Mixers: 1
• Package / Case: 8-SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Gain: -
• Noise Figure: -
• Secondary Attributes: -
• Lead Free Status / Rohs Status: Compliant

Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
x Apply solder paste using a stencil printer or dot place-
x Follow solder paste and vendor’s recommendations
x Packages have been qualified to withstand a
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 13. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially gener ate more
voids underneath. On the other hand, stencilopenings
larger than 100% will lead to excessive solder paste smear
AMMP-6546 Part Number Ordering Information
6
Part Number
AMMP-6546-BLKG
AMMP-6546-TR1G
AMMP-6546-TR2G
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temper-
ature to the pre-heat temperature to avoid damage
due to thermal shock.
peaktemperature of 260°C for 20 seconds. Verify that
the profile will not expose device beyond these limits.
No. of Devices
10
100
500
Container
antistatic bag
7” Reel
7” Reel
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automatedre-
flow processes is shown in Figure 14. This profile isde-
signed to ensure reliable finished joints. However, the
profile indicated in Figure 14 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 14. Suggested lead-free reflow profile for SnAgCu solder paste
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat
100
Ramp 2
Peak = 250 ± 5°C
Time (Seconds)
150
Reflow
Melting point = 218°C
200
Cooling
250
300