ICK BGA 14X14 FISCHER ELEKTRONIK, ICK BGA 14X14 Datasheet

ICK BGA 14X14

Manufacturer Part Number

ICK BGA 14X14

Description

HEAT SINK, BALL GRID

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_BGA_14X14.pdf (1 pages)

Specifications of ICK BGA 14X14

Packages Cooled

BGA

Thermal Resistance

30Â°C/W

External Width

14mm

Height

6mm

Heat Sink Material

Aluminium

External Depth

14mm

External Length / Height

6mm

Surface Finish

Plain

External Height

6mm

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for PGAs and BGAs

– particularly suited for Ball Grid Arrays

– heatsink dimensions match the respective BGA-type

– can be glued directly on the BGA component

ICK BGA 10 x 10

WLF ... 10 x 10

ICK BGA 10 x 10 x 10

WLF ... 10 x 10

ICK BGA 14 x 14

WLF ... 14 x 14

ICK BGA 14 x 14 x 10

WLF ... 14 x 14

ICK BGA 21 x 21

WLF ... 21 x 21

B 13

art. no.

Thermal conduct. foil WLFT 404/405

Thermal conductive glue

Thermal conductive paste

Processor overview

E 5

E 14

E 12

B 2 - 7

Hola1

SMD-heatsinks

Mounting material for semiconduct.

Hole pattern

Technical introduction

B 25 – 27

E 34 – 38

A 21

A 2 - 7

Related parts for ICK BGA 14X14

Related keywords

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ICK BGA 14X14 pdf datasheet
ICK BGA 14X14 component
ICK BGA 14X14 part
ICK BGA 14X14 distributor
ICK BGA 14X14 RoHS
ICK BGA 14X14 datasheet download