ICK BGA 23X23 FISCHER ELEKTRONIK, ICK BGA 23X23 Datasheet

ICK BGA 23X23

Manufacturer Part Number

ICK BGA 23X23

Description

HEAT SINK, BALL GRID

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_BGA_23X23.pdf (1 pages)

Specifications of ICK BGA 23X23

Packages Cooled

BGA / PLCC-68

Thermal Resistance

23Â°C/W

External Width

23mm

Height

6mm

External Depth

23mm

External Length / Height

6mm

Surface Finish

Plain

External Height

6mm

Fixing

RoHS Compliant

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Heatsinks for PGAs and BGAs

Thermal conduct. foil WLFT 404/405

Thermal conductive glue

Thermal conductive paste

Processor overview

ICK BGA 23 x 23

WLF ... 23 x 23

ICK BGA 23 x 23 x 10

WLF ... 23 x 23

ICK BGA 27 x 27

WLF ... 27 x 27

ICK BGA 27 x 27 x 10

WLF ... 27 x 27

ICK BGA 31 x 31

WLF ... 31 x 31

ICK BGA 31 x 31 x 10

WLF ... 31 x 31

art. no.

E 5

E 14

E 12

B 2 - 7

SMD-heatsinks

Mounting material for semiconduct.

Hole pattern

Technical introduction

Hola1

B 25 – 27

E 34 – 38

A 21

A 2 - 7

B 14

Related parts for ICK BGA 23X23

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ICK BGA 23X23 datasheet
ICK BGA 23X23 data sheet
ICK BGA 23X23 pdf datasheet
ICK BGA 23X23 component
ICK BGA 23X23 part
ICK BGA 23X23 distributor
ICK BGA 23X23 RoHS
ICK BGA 23X23 datasheet download