MLG1005SR10JT TDK Corporation, MLG1005SR10JT Datasheet - Page 5

• Manufacturer Part Number: MLG1005SR10JT
• Description: INDUCTOR
• Manufacturer: TDK Corporation
• Series: MLG1005r

Specifications of MLG1005SR10JT

• Rohs Compliant: YES
• Inductance: 100 nH
• Tolerance: 5 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 2 Ohms
• Self Resonant Frequency: 0.9 GHz
• Q Minimum: 8
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Package / Case: 0402 (1005 metric)
• Dimensions: 0.5 mm W x 1 mm L x 0.5 mm H
• Test Frequency: 100 MHz
• Lead Free Status / Rohs Status: Details

MLG Series MLG1005M Type (For Wireless LAN & Bluetooh)
FEATURES
• Nominal inductance values are supported from 0.6 to 5.6nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
The most suitable in high frequency circuit of 2.4GHz and 5GHz
wireless LAN & Bluetooh.
SHAPES AND DIMENSIONS
RECOMMENDED PC BOARD PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
and sintering process with ceramic and conductive materials for
high-frequency.
soldering.
Preheating
60 to 120s
1.0±0.05
0.25±0.1
Time(s)
Soldering
10s max.
30 to 60s
Dimensions in mm
Natural
cooling
Weight: 1mg
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
SPECIFICATIONS
Operating temperature range
Storage temperature range
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• When hand soldering, apply the soldering iron to the printed
MLG 1005 M 2N2 B
(1)
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
apply stress through board bending or mishandling.
circuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
1005
2N2
5N6
B
T
(2)
(3) (4) (5) (6)
T
–55 to +125°C
–55 to +125°C [Unit of products]
006-01 / 20070703 / e521_mlg1005.fm
2.2nH
5.6nH
±0.1nH
Taping (reel)
1.0× 0.5mm(L× W)
Quantity
15000 pieces/reel
(5/6)