MPU-6050 INVENSENSE, MPU-6050 Datasheet

no-image

MPU-6050

Manufacturer Part Number
MPU-6050
Description
GYRO/ACCEL, 9-AXIS FUSION, PROG, I2C
Manufacturer
INVENSENSE
Datasheet

Specifications of MPU-6050

No. Of Axes
9
Sensor Case Style
QFN
No. Of Pins
24
Supply Voltage Range
2.5V To 3.6V
Operating Temperature Range
-40°C To +85°C
Interface
I2C
Acceleration Range
± 2g, ± 4g, ± 8g, ± 16g
Interface Type
I2C, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPU-6050
Manufacturer:
INVENSEN
Quantity:
13 000
Part Number:
MPU-6050
Manufacturer:
INVENSE
Quantity:
20 000
Part Number:
MPU-6050
0
Company:
Part Number:
MPU-6050
Quantity:
8 000
Part Number:
MPU-6050A
Manufacturer:
INVENSENS
Quantity:
20 000
Part Number:
MPU-6050C
Manufacturer:
FREESCALE
Quantity:
9 440
Part Number:
MPU-6050C
Manufacturer:
INVENSENMSE
Quantity:
20 000
Company:
Part Number:
MPU-6050C
Quantity:
3 000
Part Number:
MPU-6050ES
Manufacturer:
INVENSE
Quantity:
20 000
Part Number:
MPU-6050M
Manufacturer:
INVENSE
Quantity:
20 000
Part Number:
MPU-6050MPU-6050MPU-6050
0
InvenSense Inc.
Document Number: PS-MPU-6000A-00
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Revision: 1.0
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Release Date: 11/24/2010
Website: www.invensense.com
MPU-6000 and MPU-6050
Product Specification
Revision 1.0
1 of 53

Related parts for MPU-6050

MPU-6050 Summary of contents

Page 1

... InvenSense Inc. 1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A. Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com MPU-6000 and MPU-6050 Product Specification Revision 1 Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 ...

Page 2

... MPU-6000/MPU-6050 Product Specification CONTENTS 1 REVISION HISTORY ................................................................................................................................... 5   2 PURPOSE AND SCOPE ............................................................................................................................. 6   3 PRODUCT OVERVIEW ............................................................................................................................... 6   4 APPLICATIONS ........................................................................................................................................... 7   5 FEATURES .................................................................................................................................................. 8   5   YROSCOPE EATURES 5   CCELEROMETER EATURES 5   DDITIONAL EATURES 5 .......................................................................................................................... 9   OTION ROCESSING 5.5 C ........................................................................................................................................... 9   LOCKING 6 ELECTRICAL CHARACTERISTICS ......................................................................................................... 10   6   YROSCOPE PECIFICATIONS 6 ...

Page 3

... SPI (MPU-6000   AND 2 10 .................................................................................................................................. 32   NTERFACE 2 10   OMMUNICATIONS 2 10 ........................................................................................................................................ 35   ERMS 10.5 SPI I (MPU-6000   NTERFACE 11 SERIAL INTERFACE CONSIDERATIONS (MPU-6050) .......................................................................... 37   11.1 MPU-6050 S   UPPORTED 11 ................................................................................................................................... 37   OGIC EVELS 11   OGIC EVELS IAGRAM FOR 11   OGIC EVELS IAGRAM FOR 12 ASSEMBLY ............................................................................................................................................... 40   ...

Page 4

... MPU-6000/MPU-6050 Product Specification 12.4   OMPONENT LACEMENT 12.4.5 PCB M   OUNTING AND 12.4.6 MEMS H I   ANDLING NSTRUCTIONS 12.4.7 ESD C   ONSIDERATIONS 12.4   EFLOW PECIFICATION 12.4   TORAGE PECIFICATIONS 12.4.   YRO EMOVAL FROM 12   ACKAGE ARKING PECIFICATION 12.6 T &   ...

Page 5

... MPU-6000/MPU-6050 Product Specification 1 Revision History Revision Date Revision Description 11/24/2010 1.0 First revision of MPU-60X0 Product Specification Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 ...

Page 6

... For power supply flexibility, the MPU-60X0 operates from VDD power supply voltages of 2.5V±5%, 3.0V±5%, or 3.3V±5%. Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply pin, VDD), which sets the logic levels of its I Document Number: PS-MPU-6000A-00 Revision: 1 ...

Page 7

... MPU-6000/MPU-6050 Product Specification The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I and has a separate VLOGIC reference pin. The MPU-6000 supports both I single supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part. ...

Page 8

... Digital-output temperature sensor  User-programmable digital filters for gyroscope, accelerometer, and temp sensor  10,000 g shock tolerant 2  400kHz Fast Mode I C for communicating with all registers Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 2 C interface voltages (MPU-6050 only ...

Page 9

... MPU-6000/MPU-6050 Product Specification  1MHz SPI serial interface for communicating with all registers (MPU-6000 only)  20MHz SPI serial interface for reading of sensor and interrupt registers (MPU-6000 only)  MEMS structure hermetically sealed and bonded at wafer level  RoHS and Green compliant 5 ...

Page 10

... MPU-6000/MPU-6050 Product Specification 6 Electrical Characteristics 6.1 Gyroscope Specifications VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T PARAMETER GYROSCOPE SENSITIVITY Full-Scale Range Gyroscope ADC Word Length Sensitivity Scale Factor Sensitivity Scale Factor Tolerance Sensitivity Scale Factor Variation Over ...

Page 11

... MPU-6000/MPU-6050 Product Specification 6.2 Accelerometer Specifications VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T PARAMETER ACCELEROMETER SENSITIVITY Full-Scale Range ADC Word Length Sensitivity Scale Factor Initial Calibration Tolerance Sensitivity Change vs. Temperature Nonlinearity Cross-Axis Sensitivity ZERO-G OUTPUT Initial Calibration Tolerance Zero-G Level Change vs ...

Page 12

... MPU-6000/MPU-6050 Product Specification 6.3 Electrical and Other Common Specifications VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T PARAMETER CONDITIONS VDD POWER SUPPLY Operating Voltages Normal Operating Current Gyroscope + Accelerometer + DMP Gyroscope + DMP (Accelerometer disabled) Accelerometer only (DMP & ...

Page 13

... MPU-6000/MPU-6050 Product Specification 6.4 Electrical Specifications, Continued VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, T PARAMETER CONDITIONS TEMPERATURE SENSOR Range Sensitivity Untrimmed Temperature Offset 35 Linearity Best fit straight line (-40°C to +85° ADDRESS AD0 = 0 AD0 = 1 DIGITAL INPUTS (SDI/SDA, ...

Page 14

... MPU-6000/MPU-6050 Product Specification 6.5 Electrical Specifications, Continued Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD 25°C A Parameters 2 Primary I C I/O (SCL, SDA LOW-Level Input Voltage HIGH-Level Input Voltage Hysteresis hys VIL, LOW Level Input Voltage ...

Page 15

... MPU-6000/MPU-6050 Product Specification 6.6 Electrical Specifications, Continued Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD 25°C A Parameters INTERNAL CLOCK SOURCE Gyroscope Sample Rate, Fast Gyroscope Sample Rate, Slow Accelerometer Sample Rate ...

Page 16

... MPU-6000/MPU-6050 Product Specification 2 6 Timing Characterization Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD 25°C A Parameters TIMING f , SCL Clock Frequency SCL t , (Repeated) START Condition Hold HD.STA Time t , SCL Low Period LOW ...

Page 17

... MPU-6000/MPU-6050 Product Specification 6.8 SPI Timing Characterization (MPU-6000 only) Typical Operating Circuit of Section 7.2, VDD = 2.5V±5%, 3.0V±5%, or 3.3V±5%, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD,T = -40°C to +85°C, unless otherwise noted. A Parameters SPI TIMING f , SCLK Clock Frequency SCLK t , SCLK Low Period ...

Page 18

... These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. Parameter Supply Voltage, VDD VLOGIC Input Voltage Level (MPU-6050) REGOUT Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT, SCL, SDA) CPOUT (2.5V ≤ ...

Page 19

... MPU-6000/MPU-6050 Product Specification 7 Applications Information 7.1 Pin Out and Signal Description MPU- MPU- Pin Number 6000 6050 19 15, 16, 17 Pin Name CLKIN Optional external reference clock input. Connect to GND if unused. 2 AUX_DA I C master serial data, for connecting to external sensors 2 AUX_CL ...

Page 20

... Component Regulator Filter Capacitor (Pin 10) VDD Bypass Capacitor (Pin 13) Charge Pump Capacitor (Pin 20) VLOGIC Bypass Capacitor (Pin 8) * MPU-6050 Only. ** Currently, the part has been characterized only with 10nF capacitor. Characterization with a 2.2nF value is pending. Label Specification C1 Ceramic, X7R, 0.1µF ±10 Ceramic, X7R, 0.1µ ...

Page 21

... MPU-6000/MPU-6050 Product Specification 7.4 Recommended Power-on Procedure Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 ...

Page 22

... MPU-6000/MPU-6050 Product Specification 7.5 Block Diagram 7.6 Overview The MPU-60X0 is comprised of the following key blocks and functions:  Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning  Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning  ...

Page 23

... The MPU-60X0 communicates to a system processor using either SPI (MPU-6000 only interfaces, and the device always acts as a slave when communicating to the system processor. The logic level for communications to the master is set by the voltage on the VLOGIC pin – (MPU-6050 VDD (MPU-6000). The LSB of the of the slave address is set by pin 9 (AD0) ...

Page 24

... MPU-6000/MPU-6050 Product Specification 2 7.11 Auxiliary I C Serial Interface The MPU-60X0 has an auxiliary I or other sensors. This bus has two operating modes: I master to an external sensor(s) connected to the auxiliary I MPU-60X0 directly connects the primary and auxiliary I directly communicate with the external sensor(s). ...

Page 25

... MPU-6000/MPU-6050 Product Specification 7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I In the figure below, the system processor master to the optional external compass sensor. The MPU-6000 has limited capabilities Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors. ...

Page 26

... MPU-6000/MPU-6050 Product Specification 7.14 MPU-6000 Using SPI Interface In the figure below, the system processor is an SPI master to the MPU-6000. Pins 8, 9, 23, and 24 are used to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are 2 shared with the I ...

Page 27

... MPU-6000/MPU-6050 Product Specification 8 Programmable Interrupts The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin. Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually. Table of Interrupt Sources Interrupt Name Free Fall Detection ...

Page 28

... MPU-6000/MPU-6050 Product Specification 8.1 Free Fall, Motion, and Zero Motion Signal Paths The diagram below shows the signal path for the gyroscope and accelerometer sensors. Note that each digital low pass filter (DLPF) is configured identically each sample rate divider and digital high pass filter (DHPF) ...

Page 29

... MPU-6000/MPU-6050 Product Specification counter threshold, a motion interrupt is triggered. The axis and polarity which caused the interrupt to be triggered is flagged in the MOT_DETECT_STATUS register. Like with Free Fall detection, Motion detection has a configurable acceleration threshold MOT_THR specified in steps of 1 mg. The counter threshold MOT_DUR is specified in steps of 1 ms. The decrement rate has the same options as Free Fall detection, and is specified in the MOT_DETECT_CTRL register ...

Page 30

... MPU-6000/MPU-6050 Product Specification 9 Clocking 9.1 Internal Clock Generation The MPU-60X0 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for generating this clock ...

Page 31

... The bias and LDO section generates the internal supply and the reference voltages and currents required by the MPU-60X0. Its two inputs are an unregulated VDD of 2.1V to 3.6V and a VLOGIC logic reference supply voltage of 1.71V to VDD (MPU-6050 only). The LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the 9 ...

Page 32

... MPU-6000/MPU-6050 Product Specification 10 Digital Interface 2 10 and SPI (MPU-6000 only) Serial Interfaces The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode. Serial Interface Pin Number MPU-6000 MPU-6050 Note prevent switching into I C mode when using SPI (MPU-6000), the I setting the I2C_IF_DIS configuration bit ...

Page 33

... MPU-6000/MPU-6050 Product Specification Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition. Data Format / Acknowledge data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse ...

Page 34

... MPU-6000/MPU-6050 Product Specification Communications After beginning communications with the START condition (S), the master sends a 7-bit slave address th followed bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device ...

Page 35

... MPU-6000/MPU-6050 Product Specification To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the MPU-60X0, the master transmits a start signal followed by the slave address and read bit result, the MPU-60X0 sends an ACK signal and the data ...

Page 36

... MPU-6000/MPU-6050 Product Specification 10.5 SPI Interface (MPU-6000 only) SPI is a 4-wire synchronous serial interface that uses two control and two data lines. The MPU-6000 always operates as a Slave device during standard Master-Slave SPI operation. With respect to the Master, the Serial Clock output (SCLK), the Data Output (SDO) and the Data Input (SDI) are shared among the Slave devices. The Master generates an independent Chip Select (/CS) for each Slave device ...

Page 37

... The MPU-6050 supports I C communications on both its primary (microprocessor) serial interface and its auxiliary interface. 11.2 Logic Levels The MPU-6050 I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below. I/O Logic Levels vs. AUX_VDDIO MICROPROCESSOR LOGIC LEVELS AUX_VDDIO 0 1 Note: The power-on-reset value for AUX_VDDIO is 0 ...

Page 38

... AUX_VDDIO = 0. Note: Actual configuration will depend on the auxiliary sensors used. I/O Levels and Connections for AUX_VDDIO = 0 Notes: 1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL (0 = set output levels relative to VLOGIC) 2. Other MPU-6050 logic IO is always referenced to VLOGIC. Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 ...

Page 39

... AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL. AUX_VDDIO = 1 sets output levels relative to VDD. 2. Other MPU-6050 logic IO is always referenced to VLOGIC. 3. Third-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and INT2 may be set to push-pull outputs, and external pull-up resistors are not needed ...

Page 40

... MPU-6000/MPU-6050 Product Specification 12 Assembly This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits. 12.1 Orientation of Axes The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier in the figure ...

Page 41

... MPU-6000/MPU-6050 Product Specification 12.2 Package Dimensions PIN 1 IDENTIFIER IS A LASER MARKED FEATURE ON TOP SYMBOLS DIMENSIONS IN MILLIMETERS MIN NOM A 0.85 0.90 A1 0.00 0.02 b 0.18 0.25 c --- 0.20 REF. D 3.90 4.00 D2 2.95 3.00 E 3.90 4.00 E2 2.75 2.80 e --- 0.50 f (e-b) 0.20 0.25 L 0.30 0.35 L1 0.35 ...

Page 42

... MPU-6000/MPU-6050 Product Specification 12.3 PCB Design Guidelines: The Pad Diagram is shown below using a JEDEC type extension with solder rising on the outer edge. The Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-60X0 product. JEDEC type extension with solder rising on outer edge ...

Page 43

... MPU-6000/MPU-6050 Product Specification SYMBOLS Nominal Package I/O Pad Dimensions e Pad Pitch b Pad Width L Pad Length L1 Pad Length D Package Width E Package Length D2 Exposed Pad Width E2 Exposed Pad Length I/O Land Design Dimensions (Guidelines ) D3 I/O Pad Extent Width E3 I/O Pad Extent Length c Land Width ...

Page 44

... MPU-6000/MPU-6050 Product Specification changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS. 12.4.3 Trace Routing Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the package of frequencies from DC to 1MHz do not affect the operation of the MEMS gyro. However, routing traces or vias under the MEMS gyro package, such that they run under the exposed die pad, is prohibited ...

Page 45

... MPU-6000/MPU-6050 Product Specification The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with respect to the package. 12.4.6 MEMS Handling Instructions MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical structures ...

Page 46

... MPU-6000/MPU-6050 Product Specification Approved IR/Convection Solder Reflow Curve Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above Step Setting Temp (° room B T 150 Smin C T 200 Smax D T 217 Liquidus E T 255 Pmin [255°C, 260° 260 Pmax [ 260°C, 265°C] ...

Page 47

... MPU-6000/MPU-6050 Product Specification 12.4.9 Storage Specifications The storage specification of the MPU-60X0 gyroscope conforms to IPC/JEDEC J-STD-020D.01 Moisture Sensitivity Level (MSL) 3. Calculated shelf-life in moisture-sealed bag After opening moisture-sealed bag 12.4.10 Gyro Removal from PCB Never apply high mechanical force while removing MEMS gyros from PCB. Otherwise, the QFN package leads can be removed and failure analysis of the gyro unit will be impossible ...

Page 48

... MPU-6000/MPU-6050 Product Specification 12.6 Tape & Reel Specification Reel Dimensions and Package Size PKG SIZE L Tape Dimensions Reel Outline Drawing REEL (mm Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 Z ...

Page 49

... MPU-6000/MPU-6050 Product Specification 4x4 330 Package Orientation Pin 1 Reel Specifications Quantity Per Reel 5,000 Reels per Box 1 Boxes Per Carton (max) 3 full pizza boxes packed in the center of the carton, buffered by two empty pizza boxes (front and back). Pcs/Carton (max) 15,000 100 ...

Page 50

... MPU-6000/MPU-6050 Product Specification 12.7 Label 12.8 Packaging Moisture Barrier Bag With Labels Reel in Box Document Number: PS-MPU-6000A-00 Revision: 1.0 Release Date: 11/24/2010 Anti-static Label Moisture-Sensitive Caution Label Tape & Reel Label Box with Tape & Reel Label Location of Label Moisture-Sensitive Caution Label ...

Page 51

... MPU-6000/MPU-6050 Product Specification 13 Reliability 13.1 Qualification Test Policy InvenSense’s products complete a Qualification Test Plan before being released to production. The Qualification Test Plan for the MPU-60X0 followed the JEDEC 47G.01 Standards, “Stress-Test-Driven Qualification of Integrated Circuits,” with the individual tests described below. ...

Page 52

... MPU-6000/MPU-6050 Product Specification (1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F 14 Environmental Compliance The MPU-60X0 is RoHS and Green compliant. The MPU-60X0 is in full environmental compliance as evidenced in report HS-MPU-6000A, Materials Declaration Data Sheet. Environmental Declaration Disclaimer: InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity documents for the above component constitutes are on file ...

Page 53

... MPU-6000/MPU-6050 Product Specification This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice ...

Related keywords