MPU-6050 INVENSENSE, MPU-6050 Datasheet - Page 45

• Manufacturer Part Number: MPU-6050
• Description: GYRO/ACCEL, 9-AXIS FUSION, PROG, I2C
• Manufacturer: INVENSENSE

Specifications of MPU-6050

• No. Of Axes: 9
• Sensor Case Style: QFN
• No. Of Pins: 24
• Supply Voltage Range: 2.5V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Interface: I2C
• Acceleration Range: ± 2g, ± 4g, ± 8g, ± 16g
• Interface Type: I2C, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with
respect to the package.
12.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The MPU-60X0 gyroscope has been qualified to a shock tolerance of 10,000g. InvenSense packages its
gyroscopes as it deems proper for protection against normal handling and shipping. It recommends the
following handling precautions to prevent potential damage.


12.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.

Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensure
that all workstations and personnel are properly grounded to prevent ESD.
12.4.8 Reflow Specification
Qualification Reflow: The MPU-60X0 gyroscope was qualified in accordance with IPC/JEDEC J-STD-
020D.01. This standard classifies proper packaging, storage and handling to avoid subsequent thermal and
mechanical damage during assembly solder reflow attachment. Classification specifies a sequence
consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed by three solder
reflow cycles and functional testing for qualification. All temperatures refer to the topside of the QFN
package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm thick.
Production Reflow: Check the recommendations of your solder manufacturer.
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below that were used for the qualification profile, as these represent the maximum tolerable ratings for the
device.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
MPU-6000/MPU-6050 Product Specification
45 of 53
Document Number: PS-MPU-6000A-00
Revision: 1.0
Release Date: 11/24/2010
For optimum results,