ADSP-21062KS-160 Analog Devices Inc, ADSP-21062KS-160 Datasheet - Page 3

Digital Signal Processor IC

ADSP-21062KS-160

Manufacturer Part Number
ADSP-21062KS-160
Description
Digital Signal Processor IC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr

Specifications of ADSP-21062KS-160

Supply Voltage Max
5.25V
Dsp Type
Fixed / Floating Point
Mounting Type
Surface Mount
Package / Case
240-MQFP
Memory Organization - Ram
2M
Rohs Status
RoHS non-compliant
Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
256kB
Voltage - I/o
5.00V
Voltage - Core
5.00V
Operating Temperature
0°C ~ 85°C
Package
240MQFP
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
40 MHz
Ram Size
256 KB
Device Million Instructions Per Second
40 MIPS
Lead Free Status / RoHS Status

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21062KS-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
ADSP-21062KS-160
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
CONTENTS
Summary ............................................................... 1
Key Features—Processor Core .................................... 1
Processor Features (Continued) .................................. 2
Parallel Computations .............................................. 2
Up to 4M Bit On-Chip SRAM ..................................... 2
Off-Chip Memory Interfacing ..................................... 2
DMA Controller ...................................................... 2
Host Processor Interface to 16- and 32-Bit Microprocessors 2
Multiprocessing ....................................................... 2
Serial Ports ............................................................. 2
Contents ................................................................ 3
Revision History ...................................................... 3
General Description ................................................. 4
Pin Function Descriptions ........................................ 10
REVISION HISTORY
3/08—Rev. E to Rev. F
Revised Absolute Maximum Ratings ............................
Corrected model package descriptions.
See Ordering Guide..................................................
SHARC Family Core Architecture ............................ 4
Memory and I/O Interface Features ........................... 5
Development Tools ............................................... 8
Evaluation Kit ...................................................... 9
Designing an Emulator-Compatible DSP Board (Target) 9
Additional Information .......................................... 9
Target Board Connector for EZ-ICE Probe ................ 13
Rev. F | Page 3 of 64 | March 2008
20
61
ADSP-21060/ADSP-21062 Specifications ..................... 15
ADSP-21060L/ADSP-21062L Specifications ................. 18
225-Ball PBGA Ball Configurations ............................ 51
240-Lead MQFP_PQ4/CQFP Pin Configurations ........... 53
Outline Dimensions ................................................ 55
Ordering Guide ..................................................... 61
Operating Conditions (5 V) ................................... 15
Electrical Characteristics (5 V) ................................ 15
Internal Power Dissipation (5 V) ............................. 16
External Power Dissipation (5 V) ............................ 17
Operating Conditions (3.3 V) ................................. 18
Electrical Characteristics (3.3 V) ............................. 18
Internal Power Dissipation (3.3 V) .......................... 19
External Power Dissipation (3.3 V) .......................... 20
Absolute Maximum Ratings ................................... 20
ESD Caution ...................................................... 21
Package Marking Information ................................ 21
Timing Specifications ........................................... 21
Test Conditions .................................................. 47
Environmental Conditions .................................... 50
Surface-Mount Design .......................................... 60

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