TGF4124 TriQuint, TGF4124 Datasheet - Page 9

• Manufacturer Part Number: TGF4124
• Description: RF GaAs DC-4.0GHz 10 Watt HFET
• Manufacturer: TriQuint

Specifications of TGF4124

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1055832

Application circuit for the TGF4124-EPU at 2.3 GHz
The FET is soldered using AuSn solder at 300 C for 30 secs. Input and output matching networks are
0.381 mm ZrSn Tioxide substrates (Er = 38). The design load impedance is between 3
and 4
with
the 8 pF output capacitance of the FETincluded in the output network. For further explanation refer to
the application note “ Designing High Efficiency Amplifiers using HFETs” The carrier plate is 0.51 mm
gold plated copper molybdenum. Gold wire 0.018 mm diameter is used for the bonds. Four gate
bonds are required with a length of 0.42 mm. Eight drain bonds are required with a length of 0.42 mm.
Bondwire end points on the FET are in the middle of the bond pads. Refer to the figures above for
bondwire locations. Connection between the 50 ohm line input to the input match is made by a parallel
RC network. R1 in this network is 10 ohms, and C1 is 5.6 pF. R1 and C1 are surface mount 0603
piece parts.
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