BLF6G38-10 /T3 NXP Semiconductors, BLF6G38-10 /T3 Datasheet - Page 8

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BLF6G38-10 /T3

Manufacturer Part Number
BLF6G38-10 /T3
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G38-10 /T3

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.256 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
3.1 A
Maximum Operating Temperature
+ 200 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
CDFM
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
2W(Typ)
Power Gain (typ)@vds
14@28VdB
Frequency (min)
3.4GHz
Frequency (max)
3.6GHz
Package Type
CDFM
Pin Count
3
Forward Transconductance (typ)
0.8(Min)S
Drain Source Resistance (max)
1256@6.15Vmohm
Reverse Capacitance (typ)
3.6@28VpF
Operating Temp Range
-65C to 200C
Drain Efficiency (typ)
20%
Mounting
Surface Mount
Mode Of Operation
1-Carrier N-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G38-10,118
NXP Semiconductors
8. Test information
BLF6G38-10_BLF6G38-10G_1
Product data sheet
Fig 10. Component layout for 3400 MHz to 3600 MHz test circuit BLF6G38-10
Striplines are on a double copper-clad Taconic RF35 Printed-Circuit Board (PCB) with
thickness = 0.76 mm.
See
Table 9
C1
BLF6G38-10
Input Rev 2
NXP
for list of components.
Rev. 01 — 3 February 2009
C2
BLF6G38-10; BLF6G38-10G
PCB1
R1
C3
C4
WiMAX power LDMOS transistor
BLF6G38-10
Output Rev 3
NXP
C5
L1
© NXP B.V. 2009. All rights reserved.
R2
001aaj371
C6
PCB2
C7
r
= 3.5 and
8 of 15

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