BAS40-06,215 NXP Semiconductors, BAS40-06,215 Datasheet - Page 13

• Manufacturer Part Number: BAS40-06,215
• Description: DIODE SCHOTTKY 40V 120MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS40-06,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Current - Reverse Leakage @ Vr: 10µA @ 40V
• Voltage - Forward (vf) (max) @ If: 1V @ 40mA
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io) (per Diode): 120mA (DC)
• Diode Configuration: 1 Pair Common Anode
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.12 A
• Max Surge Current: 0.2 A
• Configuration: Dual Common Anode
• Forward Voltage Drop: 1 V @ 0.04 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934034550215::BAS40-06 T/R::BAS40-06 T/R

NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
4.60
4.00
Dimensions in mm
Dimensions in mm
1.20
3.00
0.85
0.85
1.30
BAS40 series; 1PSxxSB4x series
Rev. 08 — 13 January 2010
2
2
3.40
2.80
4.50
3
1.00
2.90
2.50
3.30
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
MSA439
0.60
(3x)
2.70
General-purpose Schottky diodes
preferred transport direction during soldering
solder lands
solder resist
occupied area
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
MSA427
13 of 21