BAS40-04W,115 NXP Semiconductors, BAS40-04W,115 Datasheet - Page 19

DIODE SCHOTTKY 40V 120MA SOT-323

BAS40-04W,115

Manufacturer Part Number
BAS40-04W,115
Description
DIODE SCHOTTKY 40V 120MA SOT-323
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS40-04W,115

Package / Case
SC-70-3, SOT-323-3
Mounting Type
Surface Mount
Speed
Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
10µA @ 40V
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Voltage - Dc Reverse (vr) (max)
40V
Current - Average Rectified (io) (per Diode)
120mA (DC)
Diode Configuration
1 Pair Series Connection
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.12 A
Max Surge Current
0.2 A
Configuration
Dual Series
Forward Voltage Drop
1 V @ 0.04 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934044290115::BAS40-04W T/R::BAS40-04W T/R
NXP Semiconductors
11. Revision history
Table 10.
BAS40_1PSXXSB4X_SER_8
Product data sheet
Document ID
BAS40_1PSXXSB4X_SER_8 20100113
Modifications:
BAS40_1PSXXSB4X_SER_7 20060512
BAS40_1PSXXSB4X_SER_6 20050809
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3
BAS40H_1
BAS40L_1
BAS40-05V_1
BAS40-07V_1
BAS40W_3
BAS40_SERIES_5
Revision history
Release date
19990426
19990426
20040126
19990426
20021107
20050425
20030520
20021121
20020327
19990426
20011010
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
Figure 12 “Package outline SOT363
Figure 16 “Wave soldering footprint SOD323
Figure 17 “Reflow soldering footprint SOD523
Figure 21 “Reflow soldering footprint
Figure 22 “Reflow soldering footprint SOT323
Figure 23 “Wave soldering footprint SOT323
Figure 25 “Wave soldering footprint
Figure 26 “Reflow soldering footprint SOT363
Figure 27 “Wave soldering footprint SOT363
Figure 28 “Reflow soldering footprint
Figure 29 “Reflow soldering footprint
BAS40 series; 1PSxxSB4x series
Rev. 08 — 13 January 2010
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product specification
Product specification
Product specification
Product specification
Product specification
Product data sheet
Product specification
Product specification
Product specification
Product specification
Product specification
SOT143B”: updated
(SC-88)”: updated
SOD882”: updated
SOT416”: updated
SOT666”: updated
Change notice
-
-
-
-
-
-
-
-
-
-
-
-
-
-
(SC-70)”: updated
(SC-88)”: updated
(SC-76)”: updated
(SC-70)”: updated
(SC-88)”: updated
(SC-79)”: updated
General-purpose Schottky diodes
Supersedes
BAS40_1PSXXSB4X_SER_7
BAS40_1PSXXSB4X_SER_6
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3 BAS40H_1
BAS40L_1 BAS40-05V_1
BAS40-07V_1 BAS40W_3
BAS40_SERIES_5
1PS70SB40_2
1PS75SB45_1
1PS76SB40_2
1PS79SB40_1
1PS88SB48_2
-
-
-
-
BAS40W_2
BAS40_4
© NXP B.V. 2010. All rights reserved.
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