IRFP450 Vishay, IRFP450 Datasheet - Page 2

• Manufacturer Part Number: IRFP450
• Description: MOSFET N-CH 500V 14A TO-247AC
• Manufacturer: Vishay

Specifications of IRFP450

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 400 mOhm @ 8.4A, 10V
• Drain To Source Voltage (vdss): 500V
• Current - Continuous Drain (id) @ 25° C: 14A
• Vgs(th) (max) @ Id: 4V @ 250µA
• Gate Charge (qg) @ Vgs: 150nC @ 10V
• Input Capacitance (ciss) @ Vds: 2600pF @ 25V
• Power - Max: 190W
• Mounting Type: Through Hole
• Package / Case: TO-247-3 (Straight Leads), TO-247AC
• Transistor Polarity: N Channel
• Rds(on) Test Voltage Vgs: 10V
• Peak Reflow Compatible (260 C): No
• Drain Source On Resistance @ 10v: 400mohm
• Thermal Resistance: 0.65°C/W
• Current Rating: 14A
• Gate-to-drain Charge: 53.3nC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: *IRFP450; IRFP450IR

IRFP450, SiHFP450
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
www.vishay.com
2
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
J
a
= 25 °C, unless otherwise noted
SYMBOL
SYMBOL
ΔV
R
V
R
R
t
t
R
I
I
C
V
DS(on)
C
C
V
GS(th)
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
Q
DS
g
L
L
t
I
SM
t
thCS
thJA
thJC
oss
t
t
on
DS
SD
iss
rss
S
rr
fs
gs
gd
D
r
f
S
rr
g
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
T
V
V
V
J
R
DS
GS
GS
T
= 25 °C, I
Intrinsic turn-on time is negligible (turn-on is dominated by L
G
Reference to 25 °C, I
J
= 6.2 Ω, R
= 400 V, V
= 10 V
= 10 V
= 25 °C, I
V
V
V
V
V
f = 1.0 MHz, see fig. 5
TYP.
0.24
TEST CONDITIONS
DS
DD
DS
GS
DS
-
-
= 500 V, V
= V
= 50 V, I
= 250 V, I
F
= 0 V, I
V
V
= 14 A, dI/dt = 100 A/µs
V
GS
DS
S
GS
GS
D
GS
I
= 14 A, V
= ± 20 V
= 17 Ω, see fig. 10
D
= 25 V,
, I
= 0 V,
= 0 V, T
= 14 A, V
D
D
see fig. 6 and 13
D
= 250 µA
= 250 µA
D
GS
= 8.4 A
I
= 14 A,
D
D
= 0 V
= 8.4 A
GS
= 1 mA
J
G
G
= 125 °C
DS
= 0 V
b
= 400 V,
b
MAX.
D
S
b
0.65
D
S
b
40
b
-
b
MIN.
500
2.0
9.3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S-81271-Rev. A, 16-Jun-08
Document Number: 91233
TYP.
2600
0.63
720
340
540
5.0
4.8
17
47
92
44
13
-
-
-
-
-
-
-
-
-
-
-
-
-
UNIT
°C/W
MAX.
± 100
0.40
S
250
150
810
4.0
1.4
7.2
25
20
80
14
56
-
-
-
-
-
-
-
-
-
-
-
-
and L
D
UNIT
V/°C
)
nA
µA
nC
nH
µC
pF
ns
ns
Ω
V
V
S
A
V