MFU0603-FFP1 4A0 Vishay, MFU0603-FFP1 4A0 Datasheet - Page 6

• Manufacturer Part Number: MFU0603-FFP1 4A0
• Description: Fuses 4 AMP 32V
• Manufacturer: Vishay
• Type: Thin Film Chip Fusesr
• Series: MFUr

Specifications of MFU0603-FFP1 4A0

• Current Rating: 4 Amps
• Voltage Rating: 32 Volts
• Fuse Size / Group: 0603
• Termination Style: SMD/SMT
• Body Material: Metal Alloy, Ceramic
• Dimensions: 1.55 mm L x 0.85 mm W
• Product: Surface Mount Fuse
• Interrupt Rating: 50 Amps at 32 VoltsDC
• Mounting Style: SMD/SMT
• Operating Temperature Range: + 15 C to + 35 C
• Fuse Type: Very Fast Acting
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MFU Series
Vishay Beyschlag
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body. The fuse elements are covered by a
protective coating designed for electrical, mechanical and
climatic protection. The terminations receive a final pure tin
on nickel plating.
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual fuses. Only accepted products are laid directly
into the paper tape in accordance with IEC 60286-3.
APPROVALS
The fuses are tested in accordance with IEC 60127-4 and
UL 248-14 which refers to UL 248-1, IEC 60127-1 and
IEC 60068 series. Approval of conformity is indicated by the
UMF logo on the package label. Recognition by Underwriter
Laboratories Inc. is indicated by the UL logo on the package
label.
FUNCTIONAL PERFORMANCE
Note
(1)
www.vishay.com
6
Current rating factor is in addition to the given permissible continuous current rating of 0.7
Lead (Pb)-free Identification
on the Package Label
120
110
100
90
80
70
60
50
40
30
20
10
0
- 60
- 45 - 30 - 15
For technical questions, contact:
e3
Current Rating Factor
Thin Film Chip Fuses
0
Ambient Temperature
15
(1)
30
vs. Ambient Temperature
45
[e-mail]
ASSEMBLY
The fuses are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase. The
encapsulation is resistant to all cleaning solvents commonly
used in the electronics industry, including alcohols, esters
and aqueous solutions. The fuses are RoHS compliant, the
pure tin plating provides compatibility with lead (Pb)-free
and lead-containing soldering processes. The immunity of
the plating against tin whisker growth has been proven
under extensive testing. Solderability is specified for 2 years
after production or re-qualification. The permitted storage
time is 20 years.
All products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
This includes full compliance with the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
• 2002/95/EC Restriction of the use of Hazardous
• 2002/96/EC Waste Electrical and Electronic Equipment
Annex II (ELV II)
Substances Directive (RoHS)
Directive (WEEE)
60
ϑ
amb
75
[°C]
90
105
ϑ
amb
120
MFU Series
135
Document Number: 28747
150
Revision: 06-May-10