145246-1 TE Connectivity, 145246-1 Datasheet - Page 94

• Manufacturer Part Number: 145246-1
• Description: Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 145246-1

• Number Of Contacts: 184
• Contact Plating: Gold Over Nickel
• Mounting: Surface Mount
• Termination Method: Solder
• Pitch: 1.27 mm
• Number Of Rows: 2
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Material: Phosphor Bronze
• Mounting Style: Surface Mount
• Product Height (mm): 15.49mm
• Operating Temp Range: -55C to 85C
• Pitch (mm): 1.27mm
• Housing Material: Thermoplastic
• Housing Color: Natural
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 203VAC
• Contact Resistance Max: 30
• Peak Reflow Compatible (260 C): No
• Body Material: Polyphenylene Sulfide
• Leaded Process Compatible: No
• Rohs Compliant: No
• Pcb Mounting Orientation: Vertical
• Number Of Dual Positions: 92
• Pcb Mount Style: Surface Mount
• Holddown Material: Brass
• Holddown Plating: Tin-Lead over Nickel
• Voltage (vac): 3.3
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Positions: 184
• Centerline (mm [in]): 1.27 [0.050]
• Bus Width: 64 Bit
• Pcb Mount Retention Type: Hold Down Post(s)
• Ejector: Without
• Number Of Holddowns: 3
• Family Name: PCI
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Lead Free Status / RoHS Status: Not Compliant

94
AMP ACTION PIN
Press-Fit Contacts
PC Board Thickness
ACTION PIN contacts are
designed for use in a variety of
PC board thicknesses. However,
certain ACTION PIN contacts
are to be used in specific ranges
of board thicknesses. To
promote optimum performance,
the recommended board thick-
nesses provided with the con-
nector being used must be
followed.
ACTION PIN Contact/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Connector
Linear ZIF
Type
Material Thickness
ACTION PIN
Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
.025
0.64
Card Edge Connectors
(Solder Type, Board-to-Board)
Linear ZIF Connectors
Drilled Hole
Diameter
.0453
1.151
±.001
±0.03
ACTION PIN contacts provide a reliable press-fit connection.
Localized pressure in the interface area entails oxide
break-through and helps prevent corrosion in the harshest
environments to provide a reliable connection virtually every
time. Also, radial and axial distortion are controlled to meet
today’s standards for multilayer board applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Copper *
.001-.003
0.03-0.08
Plating Thicknesses
(Continued)
Tin-Lead
.0003
0.008
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Min.
Through-Hole
Diameter
.037-.043
0.94-1.09
Plated
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Specified
Average
Radial Hole Distortion
Not
Annular Ring (See Note)
Drilled Hole
Copper Thickness
Tin-Lead Thickness
Plated Through-Hole
Maximum
Specified
Not