T1650H-6G STMicroelectronics, T1650H-6G Datasheet - Page 5

• Manufacturer Part Number: T1650H-6G
• Description: TRIAC 16A 600V HI TEMP D2PAK
• Manufacturer: STMicroelectronics
• Series: Snubberless™r

Specifications of T1650H-6G

• Triac Type: Alternistor - Snubberless
• Mounting Type: Surface Mount
• Configuration: Single
• Current - Hold (ih) (max): 75mA
• Voltage - Off State: 600V
• Current - Gate Trigger (igt) (max): 50mA
• Current - Non Rep. Surge 50, 60hz (itsm): 160A, 168A
• Current - On State (it (rms)) (max): 16A
• Voltage - Gate Trigger (vgt) (max): 1V
• Package / Case: TO-263-3, D²Pak (2 leads + Tab), TO-263AB
• Current - On State (it (rms) (max): 16A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

T1635H, T1650H
Figure 9.
Figure 11. Leakage current versus junction
1.0E+04
1.0E+03
1.0E+02
1.0E+01
1.0E+00
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0E-01
0.1
50
V
V
DRM
DRM
Relative variation of critical rate of
decrease of main current (dI/dt)c
versus reapplied (dV/dt)c
(typical values)
temperature for different values of
blocking voltage (typical values)
=V
=V
RRM
RRM
=200 V
=200 V
75
1.0
V
V
DRM
DRM
=V
=V
(dV/dt)
RRM
RRM
=400 V
=400 V
T
C
100
j
(V/µs)
(°C)
V
V
10.0
DRM
DRM
=V
=V
RRM
RRM
=600 V
=600 V
125
100.0
150
Figure 10. Relative variation of critical rate of
Figure 12. Variation of thermal resistance
80
70
60
50
40
30
20
10
8
7
6
5
4
3
2
1
0
0
25
0
5
50
decrease of main current versus
junction temperature
junction to ambient versus copper
surface under tab (Epoxy printed
circuit board FR4,
copper thickness = 35 µm)
10
15
75
S
T
CU
j
(°C)
(cm²)
20
100
25
Characteristics
30
125
35
D²PAK
150
40
5/10