TXC-06412BIOG Transwitch Corporation, TXC-06412BIOG Datasheet - Page 188

• Manufacturer Part Number: TXC-06412BIOG
• Manufacturer: Transwitch Corporation

Specifications of TXC-06412BIOG

• Lead Free Status / RoHS Status: Not Compliant

PHAST-12P Device
DATA SHEET
TXC-06412B
PRELIMINARY TXC-06412B-MB, Ed. 2
June 2005
Offset
0x02C0
0x0300
0x0400
Bits
TOH_Events_Summary_Mask
TOH_Events_LatchForInt
TOH_Contents
Table 37: Receive TOH and DCC Port
Name
-
Memory Maps and Bit Descriptions
Init
All 0x1 rw
All 0x0 cow_1
All 0x0 ro
Access
Array (324) of byte
Array (4) of nine_bits
Offset between two elements = 0x2.
Array index indicates the summary of nine
TOH_Events_LatchedForInt bits.
Summary mask of TOH Events. Refer to
TOH_Events_Summary descriptions for the layout of the
bits.
Array (36) of nine_bits
Offset between two elements = 0x2.
Array index indicates the summary of nine TOH byte
events.
Latched events on TOH bytes. Events occur if the TOH
byte content has a different value as the one in the
previous frame. The array index and the bit position
within the corresponding entry can be calculated as
follows:
Array index = (a-1)x4 + c-1
Bit position = b-1
where
See also [ITU-T G.707/Y.1322] for the TOH bytes
locations.
Offset between two elements = 0x2.
Array index indicates the TOH byte number.
Received TOH bytes (raw, unprocessed values, except
B1/B2).
The order in which bytes are mapped in memory is the
same order as these bytes appear in the TOH. For STM-
1 mode the columns are byte interleaved: column #1
corresponds to line 1, column 2 to line 2, etc.
The byte number can easily be calculated as follows:
byte number = (a-1)x36 + (b-1)x4 + c-1
where
See also [ITU-T G.707/Y.1322] for the TOH bytes
locations.
Note: B1 and B2 locations contain the EXOR of the
calculated BIP with the received BIP.
(T_RX_TOH_DCC_PORT)
• a = row number (1 to 9),
• b = multi-column number (1 to 9),
• c, for STM-4 mode = depth of the interleave within
• c, for STM-1 mode = line number (1-4).
• a = row number (1 to 9),
• b = multi-column number (1 to 9),
• c, for STM-4 mode = depth of the interleave within
• c, for STM-1 mode = line number (1-4).
the multi-column (1-4),
the multi-column (1-4),
-
Description
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