PIC18F13K50T-I/SO Microchip Technology, PIC18F13K50T-I/SO Datasheet - Page 382

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PIC18F13K50T-I/SO

Manufacturer Part Number
PIC18F13K50T-I/SO
Description
8 KB Flash, 512 RAM, 15 I/O, 10-bit ADC, USB 2.0 20 SOIC .300in T/R
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F13K50T-I/SO

Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164126 - KIT DEVELOPMENT USB W/PICKIT 2DM164127 - KIT DEVELOPMENT USB 18F14/13K50AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPXLT20SO1-1 - SOCKET TRANS ICE 20DIP TO 20SOIC
Lead Free Status / Rohs Status
 Details
PIC18F/LF1XK50
TABLE 27-2:
TABLE 27-3:
DS41350E-page 382
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS08
OS10*
Note 1: Instruction cycle period (T
F10
F11
F12
F13*
Param
Param
No.
No.
*
2: To ensure these oscillator frequency tolerances, V
3: By design.
*
† Data in “Typ” column is at 3.0V, 25C unless otherwise stated. These parameters are for design guidance
HF
T
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current
consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an
external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
possible. 0.1 F and 0.01 F values in parallel are recommended.
IOSC ST
F
F
t
Sym
rc
Sym
OSC
SYS
CLK
OSC
These parameters are characterized but not tested.
only and are not tested.
Oscillator Frequency Range
On-Chip VCO System Frequency
PLL Start-up Time (Lock Time)
CLKOUT Stability (Jitter)
OSCILLATOR PARAMETERS
PLL CLOCK TIMING SPECIFICATIONS (V
Internal Calibrated HFINTOSC
Frequency
HFINTOSC
Wake-up from Sleep Start-up Time
-40°C T
(2)
Characteristic
Characteristic
CY
A
+125°C
) equals four times the input oscillator time base period. All specified values are based on
Preliminary
Tolerance
DD
Freq.
2%
3%
5%
and V
SS
-0.25%
Min
must be capacitively decoupled as close to the device as
Min
16
DD
4
= 42.7V TO 5.5V)
Typ†
16.0
16.0
16.0
5
5
5
Typ†
Max
8
8
8
Units
MHz
MHz
MHz
+0.25%
s
s
s
 2010 Microchip Technology Inc.
Max
12
48
2
0°C  T
60°C  T
-40°C  T
V
V
V
DD
DD
DD
Units
MHz
MHz
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
ms
%
A
Conditions
A
 +60°C
A
 +85°C
 +125°C
Conditions

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