MPC855TZQ50D4 Freescale, MPC855TZQ50D4 Datasheet - Page 75

• Manufacturer Part Number: MPC855TZQ50D4
• Manufacturer: Freescale

Specifications of MPC855TZQ50D4

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Not Compliant

Figure 78
Freescale Semiconductor
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
shows the mechanical dimensions of the ZQ PBGA package.
1.
2.
3.
4.
All Dimensions in millimeters.
Dimensions and tolerance per ASME Y14.5M, 1994.
Maximum Solder Ball Diameter measured parallel to Datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
NOTE
Mechanical Data and Ordering Information
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