ALXD800EEXJCVD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJCVD C3 Datasheet - Page 617

• Manufacturer Part Number: ALXD800EEXJCVD C3
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJCVD C3

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Electrical Specifications
Note 1.
AMD Geode™ LX Processors Data Book
Symbol
TCLK limited during functional mode to 100 MHz or 1/4 of the memory data frequency.
Parameter
TCLK period
TCLK High time
TCLK Low time
TDI, TMS Setup time to TCLK rising edge
TMS Hold time from TCLK rising edge
TDI Hold time from TCLK rising edge - Boundary
scan
TDI Hold time from TCLK rising edge - Functional
TDO Output Valid Delay time from TCLK falling
edge when running boundary scan test
TDO Output Valid Delay time from TCLK falling
edge in normal functional mode
All chip I/O Setup time to TCLK rise - boundary
scan
All chip I/O Hold time from TCLK rise - boundary
scan
All chip I/O Output Valid Delay time from TCLK
falling edge - boundary scan test
Table 7-16. JTAG Interface Signals
2*T
Min
1.5
3.0
3.0
3.0
3.0
1.0
2.0
15
GLBus
4
4
3
Max
70.0
10.0
70.0
33234H
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Comments
Note 1
40% period
Hold for 2
GLBus clocks
40% period
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