MCIMX357CJQ5C Freescale, MCIMX357CJQ5C Datasheet - Page 5

MCIMX357CJQ5C

Manufacturer Part Number
MCIMX357CJQ5C
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX357CJQ5C

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX357CJQ5C
Manufacturer:
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Quantity:
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Part Number:
MCIMX357CJQ5CR2
Manufacturer:
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Quantity:
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1.3
Figure 1
2
The i.MX35 consists of the following major subsystems:
2.1
The applications processor (AP) and its domain are responsible for running the operating system and
applications software, providing the user interface, and supplying access to integrated and external
peripherals. The AP domain is built around an ARM1136JF-S core with 16-Kbyte instruction and data L1
caches, an MMU, a 128-Kbyte L2 cache, a multiported crossbar switch, and advanced debug and trace
interfaces.
Freescale Semiconductor
Functional Description and Application Information
ARM1136 Platform—AP domain
SDMA Platform and EMI—Shared domain
is the i.MX35 simplified interface block diagram.
Block Diagram
Application Processor Domain Overview
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
DDR2/SDDR
Audio/Power
Management
RAM
MSHC
UART
CSPI
Figure 1. i.MX35 Simplified Interface Block Diagram
External Memory
Interface (EMI)
Peripherals
PSRAM
SPBA
Flash/
Smart
DMA
NOR
JTAG
3 FuseBox
SPDIF
ESAI
ASRC
ATA
FEC
SSI
NAND
Flash
Bluetooth
ARM1136JF-S
L1 I/D cache
L2 cache
AIPS (2)
Memory
Platform
Internal
ARM11
AVIC
MAX
ETM
VFP
Camera
Sensor
LCD Display 1
LCD Display 2
Processing Unit
MMC/SDIO
AUDMUX
UART(2)
or WLAN
OWIRE
ARM1136 Platform Peripherals
CAN(2)
RTICv3
RNGC
I2C(3)
PWM
CSPI
SCC
KPP
SSI
IIM
Image
(IPU)
External Graphics
Keypin
Accelerator
HS USBOTG
HS USBOTGPHY
HS USBHost
FS USBPHY
eSDHC(3)
GPU 2D
GPIO(3)
GPIO(3)
WDOG
IOMUX
Timers
RTC
EPIT
ECT
ECT
GPT
Connectivity
Access
5

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