SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 139

• Manufacturer Part Number: SC2200UFH-300
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

SuperI/O Module
1.
2.
AMD Geode™ SC2200 Processor Data Book
04h-07h
04h-07h
Offset
Offset
Offset
Offset
00h
01h
02h
03h
00h
01h
02h
03h
04h
05h
06h
07h
00h
01h
02h
03h
00h
01h
02h
03h
04h
05h
LCR Register Value
FCR Register Value
Register
Register
Register
Register
TFRCC(H)
TFRCC(L)
SH_LCR
SH_FCR
LBGD(H)
TFRL(H)/
LBGD(L)
TFRL(L)/
BGD(H)
TMR(H)
BGD(L)
TMR(L)
EXCR1
EXCR2
RXFLV
TXFLV
IRCR1
RSVD
RSVD
RSVD
RSVD
Name
Name
Name
Name
BSR
BSR
BSR
BSR
LCR
MID
1
2
BTEST
LOCK
RSVD
BKSE
BKSE
BKSE
BKSE
BKSE
7
7
7
7
RXFTH[1:0]
RSVD
RSVD
SBRK
RSVD
RSVD
SBRK
RSVD
6
6
6
6
MID[3:0]
RSVD
RSVD
Table 5-56. Bank 1 Bit Map
Table 5-57. Bank 2 Bit Map
Table 5-58. Bank 3 Bit Map
Table 5-59. Bank 4 Bit Map
ETDLBK
STKP
STKP
5
5
5
5
TFRL[7:0] / TFRCC[7:0] (Low Byte Data)
PRESL[1:0]
TXFTH[1:0]
LBGD[15:8] (High Byte Data)
BGD[15:8] (High Byte Data)
LBGD[7:0] (Low Byte Data)
BGD[7:0] (Low Byte Data)
TMR[7:0] (Low Byte Data)
LOOP
EPS
EPS
4
4
4
4
Reserved
BSR[6:0] (Bank Select)
BSR[6:0] (Bank Select)
BSR[6:0] (Bank Select)
BSR[6:0] (Bank Select)
RSVD
RSVD
RSVD
Bits
Bits
Bits
Bits
TFRL[12:8] / TFRCC[12:8] (High Byte Data)
DMASWP
RSVD
PEN
PEN
3
3
3
3
RF_SIZ[1:0]
IR_SL[1:0]
TFL[5:0]
RFL[5:0]
TMR[11:8] (High Byte Data)
DMATH
TXSR
STB
STB
2
2
2
2
32580B
RID[3:0]
DMANF
CTEST
RXSR
1
1
1
1
TF_SIZ[1:0]
WLS[1:0]
WLS[1:0]
FIFO_EN
TMR_EN
EXT_SL
0
0
0
0
145