EMIF06-1502M12 STMicroelectronics, EMIF06-1502M12 Datasheet
EMIF06-1502M12
Specifications of EMIF06-1502M12
EMIF06-1502M12
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EMIF06-1502M12 Summary of contents
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... Computers and printers ■ Communication systems ■ MCU boards Description EMIF06-1502M12 is a 6-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the input pins ...
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... RM Test conditions = 30 mV MHz OSC Figure 4. 0.00 0.00 -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 -90.00 -90.00 -100.00 -100.00 100.0M 1.0G EMIF06-1502M12 Value 125 - -55 to +150 Min. Typ. Max ...
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... EMIF06-1502M12 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output ( out Figure 7. Line capacitance versus reverse voltage applied (typical value 0.0 2 Ordering information scheme Figure 8. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF) ...
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... Table 3. QFN 2.5 x 1.5 package dimensions Figure 9. Footprint 0.40 0.40 4/ Figure 10. Marking 0.20 0.60 0.25 2.10 1.80 EMIF06-1502M12 Dimensions Ref Millimeters MIN TYP MAX MIN A 0.50 0.55 0.60 0.20 A1 0.00 0.02 0.05 0.00 b 0.15 0.18 0.25 0.06 D 2.50 D2 1.70 1.80 1.90 ...
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... EMIF06-1502M12 Figure 11. Tape and reel specification Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. 2.0+/-0.05 2.0+/-0.05 ...
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... Figure 13. Recommended stencil window position 400 µm 288 µm 6/ ≥ ---- - = 1.5 T × ≥ = --------------------------- - 0. µm 5 µm 15 µm 190 µm 15 µm 200 µm 1800 µm 50 µm 1224 µm 50 µm 288 µm EMIF06-1502M12 0.40 0.20 0.60 0.25 0.40 1.80 Footprint Stencil window Footprint 2.10 ...
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... EMIF06-1502M12 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF06-1502M12 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max ...
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... EMIF06-1502M12 5 Ordering information Table 4. Ordering information Order code EMIF06-1502M12 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 12-Dec-2005 3-Jul-2006 1-Feb-2007 04-Feb-2008 Marking Package (1) E Micro QFN Revision 1 Initial release. Reformatted to current standard. Changed Figure 1 to show 2 improved results ...
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