EMIF06-1005N12 STMicroelectronics, EMIF06-1005N12 Datasheet

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... Input Figure 2. Basic cell configuration Input Typical line capacitance = Description EMIF06-1005N12 is a 6-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the input pins. ...

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... Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic impedance Forward current Series resistanc between input and output Input capacitance per line = 25 °C) amb Test conditions = 30 mV MHz osc Doc ID 16959 Rev 1 EMIF06-1005N12 Value Unit 125 ° ° 150 °C ...

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... EMIF06-1005N12 Figure 4. S21 attenuation measurement S21 (dB) 0 I2-O2 I2- I4-O4 I4-O4 I1-O1 I1-O1 I3-O3 I3-O3 I5-O5 I5-O5 I6-O6 I6- S21(dB) S21(dB 110 MHz 900 MHz F = 1.8 GHz - 50 -31 - 300k 1M 3M 10M 30M Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge). Remaining voltage on filter output ...

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... V/Div INPUT C2 2 V/Div OUTPUT C3 Figure 11. Line capacitance versus applied voltage C(pF 4/12 Figure 10. ESD response to IEC 61000-4-2 5 V/Div C2 100 ns/Div 2 V/Div OUTPUT C3 100 ns/Div Doc ID 16959 Rev 1 EMIF06-1005N12 (-15 kV air discharge) on one line INPUT V ( 100 ns/Div 100 ns/Div ...

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... EMIF06-1005N12 2 Ordering information scheme Figure 12. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF) Package Nx = Narrow Micro QFN x leads EMIF yy - Doc ID 16959 Rev 1 Ordering information scheme xxx z Nx 5/12 ...

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... TOP VIEW SIDE VIEW BOTTOM VIEW L Figure 14. Marking 0.2 1.8 2.2 Doc ID 16959 Rev 1 EMIF06-1005N12 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.45 0.5 0.55 0.018 0.020 0.022 0.02 0.05 0.0008 0.002 0.15 0.2 0.25 0.006 0.008 0.010 2.45 2.5 2 ...

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... EMIF06-1005N12 Figure 15. Flip-Chip tape and reel specification Dot identifying Pin A1 location 0.25 ± 0.02 1.20 ± 0.10 All dimensions in mm Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. 2.0 ± ...

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... Stencil opening for leads: Opening to footprint ratio is 90%. Figure 17. Recommended stencil window position 5 µ m 190 µ m 200 µ m 100 µ ≥ ---- - = 1.5 T × ≥ --------------------------- - = 0. µ µ µ m 1800 µ µ µ m 1600 µ m 100 µ m Doc ID 16959 Rev 1 EMIF06-1005N12 0.4 0.2 1.8 2.2 Stencil Window Footprint ...

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... EMIF06-1005N12 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...

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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 10/12 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 16959 Rev 1 EMIF06-1005N12 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec ...

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... EMIF06-1005N12 5 Ordering information Table 4. Ordering information Order code EMIF06-1005N12 6 Revision history Table 5. Document revision history Date Revision 12-Jan-2010 Marking Package KB Narrow µQFN 1 Initial release. Doc ID 16959 Rev 1 Ordering information Weight Base qty Delivery mode 4.48 mg 3000 Tape and reel 7” Changes ...

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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 12/12 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 16959 Rev 1 EMIF06-1005N12 ...