MC10LVEP11DG ON Semiconductor, MC10LVEP11DG Datasheet - Page 2

• Manufacturer Part Number: MC10LVEP11DG
• Description: IC BUFFER FANOUT ECL 1:2 8SOIC
• Manufacturer: ON Semiconductor
• Type: Fanout Buffer (Distribution)r

Specifications of MC10LVEP11DG

• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Frequency-max: 3GHz
• Number Of Outputs: 4
• Max Input Freq: 3000 MHz (Typ)
• Propagation Delay (max): 0.31 ns @ 2.375V to 3.8V
• Supply Voltage (max): - 3.8 V or 3.8 V
• Supply Voltage (min): - 2.375 V or 2.375 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC10LVEP11DGOS

Q1
Q0
Q1
Q0
Figure 1. 8−Lead Pinout (Top View) and Logic
1
2
3
4
Table 2. ATTRIBUTES
1. For additional information, see Application Note AND8003/D.
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Diagram
Characteristics
8
7
6
5
http://onsemi.com
V
D
D
V
Oxygen Index: 28 to 34
Charged Device Model
CC
EE
Human Body Model
Machine Model
2
Table 1. PIN DESCRIPTION
*Pins will default to 2/3 V
**Pins will default LOW when left open.
D*, D**
Q0, Q0, Q1, Q1
V
V
EP
CC
EE
PIN
UL 94 V−0 @ 0.125 in
110 Devices
37.5 kW
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect to
the most negative supply (GND) or
leave unconnected, floating open.
> 200 V
Level 1
CC
> 4 kV
> 2 kV
Value
75 kW
when left open.
FUNCTION